Senior Technical Packaging Specialist

3 days ago

Mumbai, Maharashtra, India beBeeProcess Full time ₹ 3,00,00,000 - ₹ 3,50,00,000
About This Role

We are establishing a leading-edge facility for outsourced semiconductor assembly and testing (OSAT) in India, focusing on advanced semiconductor packaging, assembly, and testing.

This is an opportunity to lead process excellence in assembly operations, optimize yields, and ensure smooth ramp-up of new technologies as a Senior Process Engineer.

  • Develop and optimize processes for semiconductor packaging.
  • Monitor key process parameters, identify bottlenecks, and drive yield improvements.
  • Support new product introduction from customer design handover to stable mass production.
  • Collaborate with equipment engineers to drive tool qualification, calibration, and process stability.
  • Analyze failures, investigate root causes, and implement corrective actions.
  • Ensure adherence to industry standards and environmental health and safety (EHS) compliance in cleanroom operations.
  • Work with global customers and cross-functional teams to ensure quality, delivery, and cost targets are met.
  • Mentor junior engineers and technicians on best practices in OSAT process engineering.
Requirements
  • Bachelor's / Master's degree in Mechanical, Electronics, Electrical, Materials, or related Engineering field.
  • 8–12 years of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
  • Strong hands-on expertise in at least one core process area.
  • Proven track record in yield improvement and process stabilization.
  • Familiarity with statistical process control (SPC), design of experiments (DOE), failure mode effects analysis (FMEA), Six Sigma, Lean Manufacturing methodologies.
  • Experience working in a cleanroom environment.
  • Excellent analytical, problem-solving, and communication skills.

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