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High Yield Process Specialist
2 weeks ago
We are seeking a highly skilled Senior Process Engineer to drive process excellence in assembly operations, optimize yields, and ensure smooth ramp-up of new technologies.
Key Responsibilities:
- Develop and optimize processes for semiconductor packaging, including Die Attach, Wire Bonding, Molding, Wafer Bumping, Singulation, Underfill, Encapsulation, etc.
- Maintain key process parameters, identify bottlenecks, and implement yield improvements.
- Spearhead NPI from customer design handover to stable mass production.
- Collaborate with equipment engineers to qualify, calibrate, and stabilize tools.
- Conduct failure analysis, root cause investigation, and corrective action implementation.
- E nsure adherence to industry standards (JEDEC, ISO, IATF) and EHS compliance in cleanroom operations.
- Work with global customers and cross-functional teams to ensure quality, delivery, and cost targets are met.
- Mentor junior engineers and technicians on best practices in OSAT process engineering.
Requirements:
- Bachelor's / Master's in Mechanical, Electronics, Electrical, Materials, or related Engineering field.
- 8–12 years of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
- Strong hands-on expertise in at least one core process area (Wire Bonding, Die Attach, Molding, WLP, Fan-out, etc.).
- Proven track record in yield improvement and process stabilization.
- Familiarity with SPC, DOE, FMEA, Six Sigma, Lean Manufacturing methodologies.
- Experience working in a cleanroom environment.
- Excellent analytical, problem-solving, and communication skills.