
Senior Semiconductor Process Lead
5 hours ago
We are seeking a seasoned semiconductor process engineer to drive excellence in our assembly operations.
As a senior process engineer, you will be responsible for leading the development and optimization of processes for semiconductor packaging, including die attach, wire bonding, molding, wafer bumping, singulation, underfill, encapsulation, and more.
- Lead process development and optimization for semiconductor packaging.
- Monitor key process parameters, identify bottlenecks, and drive yield improvements.
- Support new product introduction from customer design handover to stable mass production.
- Collaborate with equipment engineers to drive tool qualification, calibration, and process stability.
- Conduct failure analysis, root cause investigation, and corrective action implementation.
- Ensure adherence to industry standards and EHS compliance in cleanroom operations.
- Work with global customers and cross-functional teams to ensure quality, delivery, and cost targets are met.
Requirements:
- Bachelor's or Master's degree in Mechanical, Electronics, Electrical, Materials, or related Engineering field.
- 8-12 years of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
- Strong hands-on expertise in at least one core process area.
- Proven track record in yield improvement and process stabilization.
- Familiarity with SPC, DOE, FMEA, Six Sigma, Lean Manufacturing methodologies.
- Experience working in a cleanroom environment.
- Excellent analytical, problem-solving, and communication skills.
Benefits include competitive compensation, medical insurance, relocation assistance, and performance bonuses.
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