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Senior Packaging Specialist
3 weeks ago
Join a dynamic team of innovators in the field of semiconductor assembly and packaging.
About This Opportunity- We are seeking a Senior Process Engineer to drive process excellence in assembly operations, optimize yields, and ensure smooth ramp-up of new technologies.
- Developing and optimizing processes for semiconductor packaging, including die attach, wire bonding, molding, wafer bumping, singulation, underfill, encapsulation, and other key steps.
- Monitoring key process parameters, identifying bottlenecks, and implementing yield improvements.
- Supporting the introduction of new products from customer design handover to stable mass production.
- Collaborating with equipment engineers to qualify, calibrate, and stabilize tools and processes.
- Conducting failure analysis, root cause investigation, and corrective action implementation.
- Ensuring adherence to industry standards (JEDEC, ISO, IATF) and environmental health and safety (EHS) compliance in cleanroom operations.
- Working with global customers and cross-functional teams to meet quality, delivery, and cost targets.
- Mentoring junior engineers and technicians on best practices in OSAT process engineering.
- A Bachelor's or Master's degree in Mechanical, Electronics, Electrical, Materials, or related Engineering field.
- 8–12 years of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
- Strong hands-on expertise in at least one core process area (wire bonding, die attach, molding, WLP, fan-out, etc.).
- A proven track record in yield improvement and process stabilization.
- Familiarity with statistical process control (SPC), design of experiments (DOE), failure mode and effects analysis (FMEA), Six Sigma, and lean manufacturing methodologies.
- Experience working in a cleanroom environment.
- Excellent analytical, problem-solving, and communication skills.