Director of Innovation Engineering

Job Summary:

We are seeking an exceptional Director of Innovation Engineering to spearhead next-generation product development and lead a multidisciplinary engineering team comprising Electronics, Mechanical, and Embedded Systems specialists.

This is a strategic role that requires a strong background in product innovation, systems engineering, and cross-functional team leadership.

• Lead Cross-Functional Engineering Teams: Manage and coordinate the efforts of Electronics, Mechanical, and Embedded Systems teams to ensure alignment with project goals and technical excellence.
• Drive End-to-End Product Development: Oversee the design, development, and integration of complex, high-reliability systems from concept to production, ensuring performance, durability, and manufacturability.
• Strategic Technical Leadership: Define system architecture, guide technical decision-making, and ensure synergy across hardware, firmware, and mechanical domains.
• Innovation & Prototyping: Foster a culture of innovation by guiding rapid prototyping efforts, encouraging new ideas, and exploring emerging technologies for next-generation products.
• System Integration: Ensure seamless integration across electrical, mechanical, and embedded components, with a focus on IP-rated (IP65/IP68) ruggedized systems for harsh environments.
• Technical Oversight: Review and approve designs, schematics, PCB layouts, enclosure models, and firmware structures to maintain technical quality and compliance with industry standards.
• Testing & Validation: Oversee testing, validation, and debugging across all subsystems using industry-standard lab tools and methodologies.
• Project & Resource Management: Plan and manage resources, timelines, and deliverables across multiple concurrent R&D projects.
• Documentation & Compliance: Ensure high-quality documentation across all disciplines for manufacturing, compliance, assembly, and certification processes.
• Mentorship & Collaboration: Mentor engineers across disciplines, facilitate technical reviews, and drive collaboration to solve complex challenges in a fast-paced innovation environment.

The ideal candidate is a strategic thinker and hands-on problem solver with a strong background in product innovation, systems engineering, and cross-functional team leadership.

• A strong multidisciplinary background in electronics, embedded systems, and mechanical design, with the ability to lead and evaluate work across all three domains.
• Proficiency in electronic circuit design, simulation, and analysis using tools such as Altium Designer, OrCAD, or KiCAD.
• A deep understanding of PCB design, schematic capture, and multi-layer board development, including best practices for signal integrity, thermal management, and EMI/EMC compliance.
• Familiarity with embedded systems architecture, microcontroller platforms (e.g., STM32, PIC), and firmware development workflows.
• Knowledge of ruggedized mechanical design, including IP65/IP68-rated enclosures, thermal design, and environmental sealing.
• Proficiency in DFM (Design for Manufacturing) and DFA (Design for Assembly) across electrical and mechanical components.
• Hands-on experience with prototyping and validation, including the use of lab equipment such as oscilloscopes, logic analyzers, and environmental testing tools.
• A strong understanding of product lifecycle management (PLM), BOM management, and technical documentation processes.

• Proven ability to lead cross-functional engineering teams, drive collaboration, and manage complex technical programs.
• Excellent project planning, resource management, and decision-making skills.
• Strong verbal and written communication skills for cross-disciplinary coordination, reporting, and documentation.
• Comfortable presenting technical concepts to stakeholders, clients, and executive leadership.

• Strategic thinking and analytical mindset to solve complex, cross-disciplinary R&D challenges and guide teams toward innovative, high-impact solutions.
• Creative leadership with a strong drive for innovation across electronics, embedded systems, and mechanical design domains.
• Excellent communication and interpersonal skills to effectively lead and align diverse engineering teams and communicate with stakeholders at all levels.
• A high attention to detail, ensuring technical accuracy and design integrity across all phases of product development.
• Strong organizational and time management abilities to balance multiple priorities, manage project timelines, and drive fast-paced innovation.
• A collaborative mindset to foster a culture of teamwork, continuous improvement, and knowledge sharing within and across departments.

• A Bachelor's or Master's degree in Electronics Engineering, Mechanical Engineering, Embedded Systems, Mechatronics, or a related technical field.
• Additional certifications in product design, embedded systems, systems engineering, or project management (e.g., PMP, Six Sigma, CSWP, ARM Certification) are a strong advantage.
• Prior experience in defence, industrial, or high-reliability product development involving integrated hardware, firmware, and mechanical systems is highly desirable.
• A minimum of 15 years of progressive engineering experience, with at least 7–10 years in a technical leadership or managerial role overseeing cross-functional engineering teams.
• Demonstrated ability to lead multidisciplinary R&D projects, drive innovation, and deliver complex products from concept to commercialization.
• A strong understanding of product development lifecycle, design validation, and system integration practices across engineering domains.