Packaging Engineering Thermal Design Expert

14 hours ago

Bengaluru, Karnataka, India Western Digital Full time

Company Overview

Western Digital is a leading manufacturer of hard drives and solid-state storage devices. Our company thrives on the power of diversity and is committed to creating an inclusive environment where every individual can thrive through a sense of belonging, respect, and contribution.

Salary

The estimated salary for this position is $140,000 - $180,000 per year, depending on location and experience.

Job Description

In this role as a Packaging Engineering Thermal Design Expert, you will be responsible for influencing package and product thermal designs and advancing the technology of semiconductor packaging. You will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuit board assembly (PCBA) level, and host level.

Your focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. You will be responsible for modeling and characterizing the thermal response of flash products and SSD PCBA using analysis and measurement techniques.

You will interface with package & product design, electrical and physical characterization, assembly R&D, and other process teams. Lab work will be required.

Required Skills and Qualifications

To succeed in this role, you will need:

  • Solid knowledge through academic coursework or experience in thermal modeling and measurements of IC packaging and related areas.
  • A strong background in thermal sciences with emphasis on both analytical and measurement methods.
  • Thorough knowledge of material thermal properties and test methods.
  • Working knowledge in applying Computational Fluid Dynamics (CFD) in related areas; and familiarity with software tools such as FloTHERM and ANSYS Icepak.
  • Working knowledge in scientific programming.
  • A good understanding of semiconductor packaging processes, materials, technology, and trends such as: substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.
  • Strong oral and written communication skills.
  • Demonstrated strong work ethic.
  • Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.

Qualifications

MS in mechanical engineering + 3 yr industry experience is required. Ph.D. in is preferred. Knowledge of machine learning is a plus. Thermal management understanding is a plus.

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