Senior Thermal Packaging Engineer

2 weeks ago


Bengaluru, Karnataka, India Western Digital Full time
Job Description

As a member of the Packaging R&D group, you will work on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.

This position entails influencing package and product thermal designs and advancing the technology of semiconductor packaging.

You will address all thermal aspects of packaging technology and associated material and process interactions.

Solutions will be required to meet increased demands for small form factor packages with constrained physical and thermal environments.

You will be responsible for the modeling and characterization of thermal response of the flash products and SSD PCBA using analysis and measurement techniques.

This role will interface with package & product design, electrical and physical characterization, assembly R&D and other process teams.

Lab work is required.

Qualifications

A solid knowledge through academic coursework or experience is required in thermal modeling and measurements of IC packaging and related areas.

A strong background in thermal sciences with emphasis on both analytical and measurement methods is required.

Thorough knowledge of material thermal properties and test methods is required.

Working knowledge in applying Computational Fluid Dynamics (CFD) in related areas, and familiarity with software tools such as FloTHERM and ANSYS Icepak are required.

Working knowledge in scientific programming is required.

A good understanding of semiconductor packaging processes, materials, technology, and trends such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc. is required.

Strong oral and written communication skills are required.

Demonstrated strong work ethic is required.

Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development is required.

Qualifications

MS in mechanical engineering + 3 yr industry experience is required.

Ph.D. in is preferred.

PREFERRED:

Knowledge of machine learning is a plus.

Thermal management understanding is a plus.



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