APD Package Design

2 weeks ago

Bengaluru, India Cerebra IT Services Private Limited Full time

Job Description Key Responsibilities - Design IC packages using Cadence APD for high-performance applications - Understand package/substrate design and assembly rules for flip chip designs - Work with different package technologies such as MCM, flip chip/wire bond, 3D, 2.5D (added advantage) - Design High-Speed Complex Packages and PCBs with HDI, Blind, and Buried Via technologies - Create PCB designs involving high-speed parallel bus interfaces including DDR, GDDR, and HSIO (PCIe, SERDES) - Execute stack-up design while adhering to DFM/DFA rules - Set constraints and ensure compliance in layout tools

  • Cadence APD Package Design

    2 weeks ago

    Bengaluru, India Cerebra IT Services Private Limited Full time

    Job Description Responsibilities: - IC Package Design Engineer - Experience with Cadence APD IC Package Design experience with Cadence APD - Good understanding of package/substrate design and package assembly rules related to flip chip designs. - Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage -...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD - Good hands-on experience in IC Package Substrate design and Interposer Design - Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) - Good knowledge of substrate structure, design rules and material property - Experience...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...

  • Advanced package design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJD- Good hands-on experience in IC Package Substrate design and Interposer Design- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)- Good knowledge of substrate structure, design rules and material property- Experience of...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJD- Good hands-on experience in IC Package Substrate design and Interposer Design- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)- Good knowledge of substrate structure, design rules and material property- Experience of...