Advanced package design

1 week ago

Bengaluru, India Tata Consultancy Services Full time

Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJD- Good hands-on experience in IC Package Substrate design and Interposer Design- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)- Good knowledge of substrate structure, design rules and material property- Experience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP, or equivalent- Experience of Synopsys 3 D IC compiler and ICC2 is added advantage- Design experience with MCM/Si P packages, module schematic and layout design experience- Knowledge of Complex, High-Speed PCB, and IC Packaging- Understanding/ experience in scripting – Perl/ SKILL programming- Understanding of DRC and DFM (Design For Manufacturing)- Understanding in SI/PI tools, package model extraction, S-parameter

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD - Good hands-on experience in IC Package Substrate design and Interposer Design - Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) - Good knowledge of substrate structure, design rules and material property - Experience...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJD- Good hands-on experience in IC Package Substrate design and Interposer Design- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)- Good knowledge of substrate structure, design rules and material property- Experience of...

  • Advanced package Design

    11 hours ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...

  • Advanced package Design

    1 week ago

    Bengaluru, India Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...

  • Advanced package Design

    1 week ago

    Bengaluru, Karnataka, India, Karnataka Tata Consultancy Services Full time

    Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...