Advanced package Design
1 week ago
Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP, or equivalentExperience of Synopsys 3D IC compiler and ICC2 is added advantageDesign experience with MCM/SiP packages, module schematic and layout design experienceKnowledge of Complex, High-Speed PCB, and IC PackagingUnderstanding/ experience in scripting – Perl/ SKILL programmingUnderstanding of DRC and DFM (Design For Manufacturing)Understanding in SI/PI tools, package model extraction, S-parameter
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD - Good hands-on experience in IC Package Substrate design and Interposer Design - Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) - Good knowledge of substrate structure, design rules and material property - Experience...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJD- Good hands-on experience in IC Package Substrate design and Interposer Design- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)- Good knowledge of substrate structure, design rules and material property- Experience of...
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Advanced package design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJD- Good hands-on experience in IC Package Substrate design and Interposer Design- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)- Good knowledge of substrate structure, design rules and material property- Experience of...
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Advanced package Design
19 hours ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...
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Advanced package Design
1 week ago
Bengaluru, Karnataka, India, Karnataka Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...
