Advanced package Design
1 week ago
Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP, or equivalentExperience of Synopsys 3D IC compiler and ICC2 is added advantageDesign experience with MCM/SiP packages, module schematic and layout design experienceKnowledge of Complex, High-Speed PCB, and IC PackagingUnderstanding/ experience in scripting – Perl/ SKILL programmingUnderstanding of DRC and DFM (Design For Manufacturing)Understanding in SI/PI tools, package model extraction, S-parameter
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD - Good hands-on experience in IC Package Substrate design and Interposer Design - Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) - Good knowledge of substrate structure, design rules and material property - Experience...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...
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Advanced package design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJD- Good hands-on experience in IC Package Substrate design and Interposer Design- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)- Good knowledge of substrate structure, design rules and material property- Experience of...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJD- Good hands-on experience in IC Package Substrate design and Interposer Design- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)- Good knowledge of substrate structure, design rules and material property- Experience of...
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Advanced package Design
18 hours ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD) Location- Bangalore Experience - 5+years JD Good hands-on experience in IC Package Substrate design and Interposer Design Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF) Good knowledge of substrate structure, design rules and material property Experience of...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...
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Advanced package Design
1 week ago
Bengaluru, India Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...
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Advanced package Design
1 week ago
Bengaluru, Karnataka, India, Karnataka Tata Consultancy Services Full timeSkill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence...
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Packaging Designer
2 weeks ago
Bengaluru, Karnataka, India RELIX HR Consulting Pvt Ltd - Recruitment Partner for Excellence Full time ₹ 1,00,00,000 - ₹ 2,00,00,000 per yearJob Descriptions –Package designer / Allegro Package Designer· years in IC package design and development with proficiency with Cadence Allegro Package Designer.· Netlist creation, BGA creation as per the inputs Conduct feasibility studies to advise optimum pad layout, interconnect types and substrate parameters for a specific IC device or...
