Technical Lead – Mechanical

3 days ago

Bengaluru, India CoreEL Technologies Full time

Professional Skills: • Minimum 10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Avionics/Telecom industry. • Experience in milled, sheet metal and plastic enclosure designs. • Knowledge in 19-inch rack, ATR, VPX, JSS55555, DO-160, VME and ATCA standards. • 10-years’ experience in Solid works / any design and drafting tools • Knowledge of Structural and Thermal analysis. • Ability to manage 2-member team • As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and/or associated tooling related to the electronics infrastructure. • The position requires highly motivated, extremely organized and self-driven individuals. As a Mechanical Engineer- Electronics Packaging Specialist will: -Perform mechanical design and development associated with packaging electronic circuits including, assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects.  -Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design. -Communicate with a team of multi-disciplined engineers (Systems , Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval. -Investigate and edit product structures, generate CAD models, 2D/3D drawings and be responsible for the final technical data package. -Create, edit, review, and drive Engineering Changes to closure. Self-Checking and Peer-Checking department designs and change notifications Roles and Responsibility: • Ability to take up mechanical design independently. • Interact with customers and project team, capture input and design accordingly. • Design the components to meet DFM and DFA and customer requirement. • Should be a team player. • Ability to manage 2-member team. Mandatory Skill Set: • Minimum10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Telecom industry. • Proficiency in Solid works and AutoCAD. • Good knowledge about BOM creation, material selection, Fastener selection, CNC machining and surface finish process. • Vendor development activities. Desired Skill Set: • Knowledge in Structural and Thermal analysis.

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