WIFI Tech Lead Engineer

1 week ago

Chennai, Tamil Nadu, India Radwin Full time ₹ 5,00,000 - ₹ 8,00,000 per year

Role Summary:

RADWIN is seeking passionate Firmware Tech Lead Engineer with 5–8 years of experience in developing Wi-Fi firmware. The role involves working on embedded software development for Wi-Fi 6/7 chipsets, focusing on Upper MAC/Lower MAC, Data and Control Paths, and performance optimization within RTOS environments. You will be part of the new RADWIN Firmware Innovation Center in Chennai contributing to high performance wireless solutions.

Key Responsibilities: Design, implement, and maintain Wi-Fi firmware modules related to:

  • Data Path and Control Path
  • Upper MAC/Lower MAC/PHY integration
  • Wi-Fi 6 and Wi-Fi 7 protocol enhancements
  • Debug critical firmware issues impacting performance, stability, and throughput.
  • Collaborate with hardware, RF, and systems teams to ensure optimal firmware operation across layers.
  • Develop and optimize firmware for real-time embedded environments, ensuring compliance with timing constraints and system KPIs.
  • Participate in code reviews, bring-up, and delivery of firmware to production hardware.
  • Support regulatory (FCC, ETSI etc.,) and feature compliance (e.g., DFS, CCA, Spectral Scan, etc.).

Why Join RADWIN?

  • Be part of a Firmware Innovation Group under experienced leadership.
  • Work on next-generation wireless technologies with cross-functional teams in a global environment.
  • Work on bleeding-edge platforms and direct engagement with chipset vendors.
  • A growth-oriented, fast-paced R&D culture where firmware leads the product innovation

Requirements:

  • 7-9 years of embedded software development focused on Wi-Fi or Cellular firmware.
  • Strong knowledge of IEEE protocols, especially Wi-Fi 6 and Wi-Fi 7 (MAC/PHY level) or similar technologies in Cellular(LTE/5G)
  • Experience in real-time embedded systems and RTOS environments.
  • Solid debugging skills for firmware bottlenecks, stability issues, and low-level Wi-Fi/Cellular stack problems.
  • Hands-on experience with Qualcomm and/or Broadcom or MediaTek or Intel (or any other chipsets)
  • Experience with Debugging tools: Wireshark, GDB, iperf, Sniffer

Advantage:

  • Experience with Qualcomm Wifi/Cellular chipsets
  • Basic experience in host-side driver development (cfg80211/nl80211, netlink communication).
  • Familiarity with Linux wireless applications (e.g., hostapd, wpa_supplicant).
  • Knowledge of OpenWRT, Yocto, QSDK, and user-space tools for embedded Wi-Fi platforms.
  • Knowhow about TDD/TDMA, FDD/FDMA
  • Basic understanding of bootloaders, BSP bring-up, and U-Boot configuration.
  • Familiarity with RF-related features such as:

o DFS

o Spectral Scan

o Transmit power and channel calibration

  • Exposure to RF equipment (e.g., spectrum analyzer) and calibration procedures.

If you are passionate to learn and contributing, we encourage you to apply even if you do not meet every "Advantage" qualification listed above.

RADWIN is an equal opportunity employer. We evaluate qualified applicants without regard to race, gender, disability or any other legally protected characteristics.

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