Mechanical Design Lead

3 days ago

Bengaluru, Karnataka, India Coreel Technologies Full time ₹ 12,00,000 - ₹ 36,00,000 per year

Professional Skills:

  • Minimum 10 years experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Avionics/Telecom industry.
  • Experience in milled, sheet metal and plastic enclosure designs.
  • Knowledge in 19-inch rack, ATR, VPX, JSS55555, DO-160, VME and ATCA standards.
  • 10-years experience in Solid works / any design and drafting tools
  • Knowledge of Structural and Thermal analysis.
  • Ability to manage 2-member team
  • As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and/or associated tooling related to the electronics infrastructure.
  • The position requires highly motivated, extremely organized and self-driven individuals. As a Mechanical Engineer- Electronics Packaging Specialist will:

    -Perform mechanical design and development associated with packaging electronic circuits including, assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects.

    -Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design.

    -Communicate with a team of multi-disciplined engineers (Systems , Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval.

    -Investigate and edit product structures, generate CAD models, 2D/3D drawings and be responsible for the final technical data package.

    -Create, edit, review, and drive Engineering Changes to closure.

    Self-Checking and Peer-Checking department designs and change notifications

Job Description:

  • Ability to take up mechanical design independently.
  • Interact with customers and project team, capture input and design accordingly.
  • Design the components to meet DFM and DFA and customer requirement.
  • Should be a team player.
  • Ability to manage 2-member team

Mandatory Skill Set:

  • Minimum10 years experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Telecom industry.
  • Proficiency in Solid works and AutoCAD.
  • Good knowledge about BOM creation, material selection, Fastener selection, CNC machining and surface finish process.
  • Vendor development activities.

.

Desired Skill Set:

  • Knowledge in Structural and Thermal analysis.

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