Design Engineer II
2 days ago
- BE/BTECH---1-4 yrs
- Very good knowledge on SCAN/ATPG/JTAG/MBIST
- Experience with one or more chip tape out that includes chip ATE bring up.
- Experience on gate level simulation with no timing and timing (SDF) simulations (ATPG/MBIST/JTAG)
- Experience in Test structures for DFT, IP integration, ATPG fault models, test point insertion, coverage improvement techniques.
- Experience in scan insertion techniques at block level and chip top level.
- Experience on Memory BIST generation, insertion, verification on RTL/Netlist level.
- Good knowledge and understanding in Analog PHY and Analog Macro tests.
- Good knowledge and understanding on JTAG for IEEE 1149.1/IEEE1149.6 standards.
- Good knowledge on test mode timing constraints
- Good knowledge about running block level and chip STA flows.
- Cross domain knowledge to resolve DFT issues with design, synthesis, physical design, STA team.
- Proficiency in industry standard tools for scan insertion, ATPG, MBIST and JTAG (preferable Cadence/Tessent tools)
- Experience with post-silicon bring up and debug on ATE.
- Good knowledge on Perl/Tcl scription skills
- Very good team player capabilities and excellent communication skills to work with a variety of teams across the global organization.
- High sense of responsibility and ownership within the team for successful tape out and post-silicon bring up of project.
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