Principal IO Mixed Signal Design Engineer

Job Description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B) global organization? We offer all that and more at Microchip Technology Inc.

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As a member of Microchips engineering community, the mixed signal design engineer will be responsible for integration and verification of mixed signal blocks in high-speed IOs in FPGAs. The successful candidate will be involved in floor planning, place and route, timing closure and integration of mixed signal blocks in the IOs.

Duties & Responsibilities

• Responsible for the integration of mixed signal blocks in the IO, which includes generation of constraint files, floor planning and place and route of performance critical digital blocks in the IO signal path, and timing closure using STA.
• Develop and integrate custom mixed signal circuits for high-speed DDR and other IO applications in advanced FinFET nodes. Experience in place and route, timing closure is required.
• Work with the IO lead to understand the design requirements and translate them into circuit architectures, implement and simulate them.
• Work closely with layout engineers on floorplan, placement and routing of their designs. Create efficient power delivery and signal routing topology to reduce congestion.
• Deliver to the chip lead all collaterals such as Verilog and functional models, timing libraries, netlists for chip level integration.
• Perform co-sim and AMS simulation to verify functionality of designs as and when necessary.
• Evaluate new design architectures and integration techniques to continuously improve the current and future IO design.
• Support IO Mixed-Signal IP through post-tapeout phase, including lab testing, customer bring-up and debug.

Requirements/Qualifications: Experience Required

• 10 years of experience in place and route and timing closure of mixed signal blocks in complex SoC.
• Experience with Virtuoso schematic capture tool.
• Experience with Tempus, Innovus and other ASIC tools.

Requirements

• Minimum of 10 years of successful prior IO development and verification efforts.
• Experience in ASIC methodology and familiarity with ASIC tools like Innovus and Tempus.
• Competency in HSPICE, co-sim, and testbench generation and simulation.
• Experience with Verilog coding.
• Knowledge about high-speed design techniques (DDRx, PCI-e, USB) and calibrations from an architectural and circuit design standpoint.
• Demonstrated competency in scripting, managing simulation queues, and data capture plus presentation using Microsoft Office tools, including Excel.
• Power analysis.
• Good analytical, oral and written communication skills.
• Able to write clean, readable presentations.
• Self-motivated, proactive team player.
• Ability to work to schedule requirements.

Beneficial Experience

• Experience with FPGA is preferred.
• Experience with Memory interfaces and SerDes interfaces.
• Familiarity with DFT and place and route.

Travel Time:

• No Travel

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.

Locations: India - Hyderabad

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