Physical Design Engineer, Sr Lead

6 days ago


Hyderabad, Telangana, India Qualcomm Full time ₹ 1,04,000 - ₹ 1,30,878 per year
Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

Minimum Qualifications:

  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

Job Description

Responsibilities:

  • STA setup, convergence, reviews and signoff for multi-mode, multi-voltage domain designs.
  • Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus.
  • Run Primetime and/or Tempus for STA flow optimization and Spice to STA correlation.
  • Evaluate multiple timing methodologies/tools on different designs and technology nodes.
  • Work on automation scripts within STA/PD tools for methodology development.
  • Good Technical writing and Communication skills, should be willing to work in cross-collaborative environment
  • Experience in design automation using TCL/Perl/Python.
  • Familiar with digital flow design implementation RTL to GDS : ICC, Innovous , PT/Tempus
  • Familiar with process technology enablement: Circuit simulations using Hspice/FineSim, Monte Carlo.

Education : B.Tech or MTech/MS in Electrical/Electronics/Microelectronics/VLSI.

Preferred Qualification/Skills

5+ years

  • Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling
  • Hands-on experience with STA tools - Prime-time, Tempus
  • Have experience in driving timing convergence at Chip-level and Hard-Macro level
  • In-depth knowledge cross-talk noise, Signal Integrity, Layout Parasitic Extraction, feed through handling,
  • Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus)
  • Knowledge of Spice simulation Hspice/FineSim, Monte Carlo. Silicon to spice model correlation.
  • Proficient is scripting languages – TCL, Perl, Awk

Basic knowledge of device physics

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