Platform & Hardware

**BANGALORE - INDIA**:
***About Airspan Networks**

***Airspan Networks is a leading provider of groundbreaking wireless solutions, enabling connectivity for the next generation of mobile and fixed networks. With a global presence, Airspan focuses on delivering innovative technologies that drive advancements in Open RAN and accelerate 5G adoption worldwide. Backed by strong investments and a team of world-class experts, Airspan supports telecom operators and enterprises in achieving their digital transformation goals.**

***At Airspan, we’re on the cutting edge of 4G and 5G RAN software and hardware development, creating innovative solutions that drive the future of wireless connectivity. With over a million cells deployed worldwide, our disruptive Open RAN platform is transforming carrier networks and critical infrastructure across the globe.**

***Airspan is more than just a workplace; it’s a launchpad for your career. We are dedicated to pushing the boundaries of technology and innovation, ensuring a bright future for both our company and our employees. Our greatest strength lies in our people—a team of brilliant minds from diverse backgrounds working together to achieve extraordinary results.**

***With offices in the USA, UK, India, Colombia, Poland, Japan, and Israel, Airspan offers a global working environment that values collaboration, creativity, and excellence. Whether you’re based in one of our offices or working remotely, you’ll be part of a dynamic team shaping the future of connectivity.**

***About the Role**:
***Job description**:
***:

- **Deep expertise in eNB and gNB platform and hardware design, including bring-up initialization Sequence.**:

- **Strong understanding of RU hardware design, eCPRI, PHY Split architectures (e.g., Split 7.2x), and SU/MU-MIMO systems.**:

- **Hands-on experience with O-RAN Indoor Small Cell and Outdoor Micro Cell Hardware**

***Key Responsibilities**:
***:

- **Architecture and Requirements, and exposure to O-RAN Network Energy Saving metrics and procedures.**:

- **Proven experience with FSM10055 mmWave and FSM10056 Sub-6 GHz SoCs, including SDR RFIC and PHY integration.**:

- **Design experience in SDR RFIC, DFE, and RFFE integration over COMe-based carrier boards.**:

- **Familiarity with mezzanine based modular board system designs.ss**:

- **Ability to deep dive ORAN HW reference designs.**:

- **Ability to deep dive SoC (Qualcomm, Intel, EdgeQ) reference designs.**:

- **Solid understanding of PMIC module for power profiling. Design knowledge of power reset circuits.**:

- **Strong command over FPGA-based platforms and SoC integration, with practical use of MATLAB, VHDL for simulation and validation.**:

- **Experience with Cadence Allegro for PCB schematic capture, layout review, and design verification.**:

- **Skilled in resource profiling for system functions (e.g., baseband processing, RF chains, digital interfaces) and hardware controller/server board selection based on project-specific compute and IO demands.**:

- **Ability to interface directly with ODM partners, articulate hardware requirements, define acceptance criteria, and ensure conformance to specifications.**:

- **Knowledge of ATE-stage validation procedures, including calibration, PA/LNA linearization, and system-level MTBF and thermal analysis.**:

- **Working knowledge of Dual Doherty PA.**:

- **Hands-on involvement in SDR9000 RFIC, and validation of RFFE interfaces. Experience with QDART.**:

- **Working knowledge hardware interfaces and IO expanders: SPI, UART, I2C.**:

- **Proficiency in preparing Visio-based hardware block diagrams and managing hardware reference design documents.**:

- **Ability to compile and manage Bill of Materials (BOM) accurately for system-level hardware builds.**:

- **Familiarity with clock units, hard sync techniques, PTP, SyncE, and GPS modules for synchronization and timing architecture.**:

- **Exposure to EDA tools (e.g., Synopsys, Cadence)**:

- **Internship or thesis projects in semiconductor labs or companies**:

- **Research publications in IEEE on digital/SoC/FPGA topics**

***Required Qualification**:
***:

- **Master / PhD in Electronics and Communication Engineering, Digital Design, Embedded Systems Design or a related field.**:

- **15-20 years of experience in Wireless Embedded Platform Designs, with a strong foundation in LTE and 5G NR technologies with ORAN and 3GPP Knowledge.**

***Required Qualification**:
***:

- **Good level of English**:

- **Service Oriented**:

- **Excellent communication and interpersonal skills**:

- **Problem solver, proactive and efficient**:

- **Self-learning capabilities**

***

**Why Join Us?**:
***At Airspan, you’ll work in an environment that values flexibility and innovation. Whether you’re an experienced professional or looking to grow your career, you’ll be joining a team that prioritizes collaboration and creativity. Be part of a company with a global reach, a strong track record, and an exciting v