Mechanical Architect

**Join FlexAI**:
FlexAI is at the forefront of revolutionizing AI computing by reengineering infrastructure at the system level. Our groundbreaking architecture, combined with sophisticated software intelligence, abstraction, and an orchestration layer, allows developers to leverage a diverse array of compute, resulting in efficient, more reliable computing at a fraction of the cost. We are seeking a skilled and experienced** Mechanical Architect.**

The rapid evolution of machine intelligence has created a need for a new system architecture capable of handling high memory capacity and bandwidth. These are critical bottlenecks in pushing machine intelligence to the next level, where compute demand is expected to increase up to 1000 times current levels.

FlexAI has pioneered a groundbreaking solution to tackle these memory challenges. Our innovative compute architecture ensures a well-balanced distribution of memory bandwidth, capacity, and compute density, ensuring maximum utilization of system resources. This architecture is the cornerstone of our datacenter-in-a-box concept, which is enabled by our universal AI compute cloud service. Our hardware solutions are built for seamless deployment with our own AI cloud offerings and other cloud service providers worldwide, setting new standards in performance and efficiency.

**Position Overview**:
FlexAI is seeking a talented Mechanical Architect to lead the design and development of cutting-edge systems for the HPC/AI market. In this role, you’ll oversee the architectural definition, design, and qualification of systems, spanning from PCB to rack-level. Partnering with technology and manufacturing experts, you’ll drive high-performance, cost-efficient solutions, playing a key role in our mission to deliver impactful AI compute systems.

This position offers the chance to work on complex challenges and shape innovative mechanical solutions within a collaborative, fast-paced environment. If you’re passionate about problem-solving and ready to make a difference in AI computing, FlexAI could be the right place for you.

**What you’ll do**:
- Conceptualize, Design, and Develop new server racks and integrated systems.
- Drive all the mechanical design aspects of HPC systems, including PCB design, advanced semiconductor packaging, structural, and thermal solutions.
- Build positive relationships with leaders of cross functional product teams, including suppliers and OEM partners to perform detailed DFM and DFA analysis, develop manufacturing solutions and to efficiently support FlexAI innovations.
- Engage in all phases of product life cycle management programs of FlexAI products, including concept, architecture, documentation, design, prototype, test and qualification, supplier interfaces, manufacturing, NPI and service support.
- Key contributor in building innovative technical proposals for systems/sub-systems development.
- Drive excellence in CTQ definition and control, FMEA, root cause analysis, design revies with (both internal & external) engineering teams, OEMs/ODMs, and lifecycle product quality improvements.
- Maintain comprehensive documentation of design specifications, simulation results, test data, and performance metrics. Provide product status update, communicate issues internally, drive tough trade-offs, and articulate judgements.
- Provide manufacturability feasibility analysis, present options and ensure the products meet the optimal balance of performance, quality, scalability, re-use, reliability, cost, and time-to-market.
- Competitions’ product benchmarking and contribution to product roadmap development.
- First article inspection (FAI) and approval of prototype parts or purchased parts, including review or completion of any required test and inspection reports.
- Release 2D drawings for manufacturing and 3D models of PCB reference designs, Chassis, Rack, and System Assemblies.

**What you’ll need**:

- Master’s or bachelor’s in mechanical engineering with a minimum of 10 years of relevant experience.
- Prior experience in designing rack-level system products is preferred, with deep knowledge of manufacturing and assembling processes, encompassing for sheet-metal based fabrication, machined parts, thermo-plastics, elastomers, and die casted parts.
- Ability to drive/challenge suppliers on their technical proposals.
- Proven experience with DFSS (Design for Six Sigma), Risk Analysis and Risk Mitigation plans, DFMEA, DFM, GD & T, Tolerance Stack-up Analysis, and Product Reliability.
- Analytical, creative, and intellectual thinker, with ability to perform mechanical design calculations & verify designs.
- Experience in designing EIA-310-D and IEC 60297 standards-compliant products.
- Hands-on experience in generating and exchanging IDF files with PCB Design
engineers.
- Self-starter, energizing, results oriented, and able to multi-task.
- Ability to meet aggressive quality, performance, cost, serviceability and delivery targets.