Chief Engineer

Job Description:

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• Lead Cross-Functional Engineering Teams to ensure alignment with project goals and technical excellence.">
• Drive End-to-End Product Development from concept to production, ensuring performance, durability, and manufacturability.">
• Strategic Technical Leadership: Define system architecture and guide technical decision-making across hardware, firmware, and mechanical domains.">
• Innovation & Prototyping: Foster a culture of innovation by guiding rapid prototyping efforts and exploring emerging technologies for next-generation products.">
• System Integration: Ensure seamless integration across electrical, mechanical, and embedded components, with a focus on ruggedized systems for harsh environments.">
• Technical Oversight: Review and approve designs, schematics, PCB layouts, enclosure models, and firmware structures to maintain technical quality and compliance with industry standards.">
• Testing & Validation: Oversee testing, validation, and debugging across all subsystems using industry-standard lab tools and methodologies.">
• Project & Resource Management: Plan and manage resources, timelines, and deliverables across multiple concurrent R&D projects.">
• Documentation & Compliance: Ensure high-quality documentation across all disciplines for manufacturing, compliance, assembly, and certification processes.">
• Mentorship & Collaboration: Mentor engineers across disciplines, facilitate technical reviews, and drive collaboration to solve complex challenges in a fast-paced innovation environment.">

Required Skills & Qualifications:

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• Strong multidisciplinary background in electronics, embedded systems, and mechanical design, with the ability to lead and evaluate work across all three domains.">
• Proficiency in electronic circuit design, simulation, and analysis using tools such as Altium Designer, OrCAD, or KiCAD.">
• Deep understanding of PCB design, schematic capture, and multi-layer board development, including best practices for signal integrity, thermal management, and EMI/EMC compliance.">
• Familiarity with embedded systems architecture, microcontroller platforms (e.g., STM32, PIC), and firmware development workflows.">
• Knowledge of ruggedized mechanical design, including IP65/IP68-rated enclosures, thermal design, and environmental sealing.">
• Proficiency in DFM (Design for Manufacturing) and DFA (Design for Assembly) across electrical and mechanical components.">
• Hands-on experience with prototyping and validation, including the use of lab equipment such as oscilloscopes, logic analyzers, and environmental testing tools.">
• Strong understanding of product lifecycle management (PLM), BOM management, and technical documentation processes.">

Leadership & Communication:

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• Proven ability to lead cross-functional engineering teams, drive collaboration, and manage complex technical programs.">
• Excellent project planning, resource management, and decision-making skills.">
• Strong verbal and written communication skills for cross-disciplinary coordination, reporting, and documentation.">
• Comfortable presenting technical concepts to stakeholders, clients, and executive leadership.">

Benefits:

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• Competitive salary">
• Opportunities for professional growth and advancement">
• Collaborative and innovative work culture">
• Exposure to cutting-edge technologies and projects">

Others:

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• Prior experience in defence, industrial, or high-reliability product development involving integrated hardware, firmware, and mechanical systems is highly desirable.">
• Demonstrated ability to lead multidisciplinary R&D projects, drive innovation, and deliver complex products from concept to commercialization.">
• Strong understanding of product development lifecycle, design validation, and system integration practices across engineering domains.">