R&D – Head OTP/MTP Technologies
2 months ago
Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.
Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.
Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.
Integration responsibilities to add OTP and MTP Features to 28-110nm platform technologies, with future extension into FinFet nodes. Work with IP providers, as needed, to implement these features.
Design and Layout of test chips and macros to aid in device/technology optimization, rel assessment and SPICE model extraction
End to end Project Management from initial project justification to final qualification and yield ramp with responsibilities for achieving desired performance, quality/yield, schedule and cost targets.
Build and lead a cross functional team across diverse geographies
Build strong customer relationships based on confidence in TEPL technical capabilities
Competitor benchmarking; ownership of technology roadmap
Presentation to internal and customer senior executives
Possible involvement in OTP development
Travel (few weeks per quarter)
Ability to manage, mentor, and lead a team of highly motivated professionals.
Able to work independently, self-motivated with a strong drive to win.
Team player with the ability to work across diverse cross-functional teams spread across the world.
Leadership skills to influence all levels of the organization.
You’re inclusive, adapting your style to the situation and diverse global norms of our people.
An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
Innovative and creative, you proactively explore new ideas and adapt quickly to change.
M.S or PhD in Electrical Engineering, Materials Science or equivalent
Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, analytical techniques (physical and electrical)
Deep understanding of OTP fuse and anti-fuse technologies along with charge trap and emerging memory technologies for MTP applications. Understands pros and cons of different approaches and can select best options for give technology and application
Ability to layout test chips and design macros (or provide specifications to IP houses for them to design the macros)
Understanding of technology parameters and figures of merit (bit cell size, macro size, endurance, retention, power, latency, mask count, etc); experience in achieving competitive performance
Proven track record in delivering these technologies into volume manufacturing
Ability to lead cross-functional teams and achieve project completion within timeline and cost targets
Ability to work across different cultures and geographies
Good team player
Innovation and competitive mindset
15+ years experience in the semiconductor industry
Proven track record of successfully developing new technologies into high volume production
Proven problem solving skills using design of experiments and analytical tools
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