R&D – Head of CMOS Integration
2 weeks ago
Integration responsibilities for transfer of 28-90nm technologies from partner facilities with emphasis on
feature additions and performance improvement
while achieving
reliability, yield, schedule and cost targets . Support initial ramp while maintaining
yield and quality metrics.Ownership of R&D for
new nodes
and
technology variants
on existing nodesDesign and Layout of test chips
to aid in device/technology optimization, rel assessment and SPICE model extractionEnd to end
Project Management
from initial project justification to final qualification and yield ramp with responsibilities for achieving desired
performance, quality/yield, schedule and cost targets.Build and lead a cross functional team across diverse geographiesBuild strong customer relationships based on confidence in TEPL technical capabilitiesCompetitor benchmarking; ownership of technology roadmapPresentation to internal and customer senior executivesTravel (few weeks per quarter)Ability to manage, mentor, and lead a team of highly motivated professionals.Able to work independently, self-motivated with a strong drive to win.Team player with the ability to work across diverse cross-functional teams spread across the world.Leadership skills to influence all levels of the organization.
You’re inclusive, adapting your style to the situation and diverse global norms of our people.An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.Innovative and creative, you proactively explore new ideas and adapt quickly to change.
M.S or PhD in Electrical Engineering, Materials Science or equivalentStrong understanding of
device physics, process modules, yield improvement, failure mechanisms, analytical techniques (physical and electrical)Proven track record in developing and transferring technologies into high volume manufacturingDeep knowledge of
CMOS, SRAM and eNVM parameters and figures of merit ; experience in achieving competitive performanceAbility to lead cross-functional teams and achieve project completion within timeline and cost targetsAbility to work across different cultures and geographiesInnovation mindset
15+ years experience in the semiconductor industryProven track record of successfully developing new technologies into high volume productionProven problem solving skills using design of experiments and analytical tools
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