IC Package Layout Design

4 days ago


bangalore, India HCLTech Full time

Job Location: BengaluruExp: 6 to 13 yearsNotice Period: Immediate to 30 Days OnlyQualification: BE/BTech/ME/MTech/MS - Electricals & Electronics EngineeringRoles & Responsibilities:IC Package Layout Design EngineerExperience with IC Package Layout Design using Cadence Allegro APD (will consider Mentor Graphics XPD, XSI tools experience also)Good understanding of package/substrate design and package assembly rules related to flip chip designs.Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage.Expertise in High-Speed Complex PCB and Package designs with HDI, Blind and Buried Via technologies.Hands-on expertise with PCB and Package layout designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES and Type C.Good Exposure to Stackup design, substrate DFM, DFA rules and adherence.Should have expertise in constraint setting in layout tool.



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