IC Package Layout Design

13 hours ago


bangalore, India HCLTech Full time

Job Location: BengaluruExp: 6 to 13 yearsNotice Period: Immediate to 30 Days OnlyQualification: BE/BTech/ME/MTech/MS - Electricals & Electronics EngineeringRoles & Responsibilities:- IC Package Layout Design Engineer- Experience with IC Package Layout Design using Cadence Allegro APD (will consider Mentor Graphics XPD, XSI tools experience also)- Good understanding of package/substrate design and package assembly rules related to flip chip designs.- Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage.- Expertise in High-Speed Complex PCB and Package designs with HDI, Blind and Buried Via technologies.- Hands-on expertise with PCB and Package layout designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES and Type C.- Good Exposure to Stackup design, substrate DFM, DFA rules and adherence.- Should have expertise in constraint setting in layout tool.



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