Modernize Chip Solutions

4 weeks ago


bangalore, India Modernize Chip Solutions (MCS) Full time

Minimum 15+ Years of experience SoC Physical Design.


Skills – have working experience in advanced FinFET node designs 7nm/5nm/3nm.

Experience with Cadence/Synopsys PnR/STA tools and Calibre; good scripting/automation skills is a must.


This position is for a senior-level physical design engineer who will work on Floor planning/Bump Planning/ Pin assignments /Feed through/ LFU Optimization/ Work hands-on to solve critical design and execution issues related to physical verification/implementation and sign-off.


Expertise :

Strong hands-on experience with Chip Level / Sub-chip level floor planning,

Performing floor-planning and routing studies and implementation at block and full-chip level

Push down the top-level floorplan and clock to Partition.

partition, pin assignment, Power planning, IO/Bump Planning, Pad Ring Creation, Die File Creation, RDL Routing, working with Package Team for Optimize the Bumps.

Closely working with Package team and reaching Die file milestones


Location- Hyd/BLR

Availability- Immediate to 60 days.



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