Tech Innovation Lead

Job Title: Tech Innovation Lead

Location: Udyog Vihar, Gurgaon

Professional Experience : Minimum 15 years 

Department: Tech Innovation Group (TIG)

Timeline for Hiring : Immediate

Application Deadline: 17 Sep 2025

CTC : INR 2,00,000/- to INR 3,00,000/- per month

About the Company:

ZOOM Communications is South Asia's leading provider of Live Broadcast Services, serving a prestigious client base across Sports, Media, Entertainment, and News. A pioneer in the Indian broadcast industry for over two decades, ZOOM has delivered high-profile national and international projects including the ICC U-19 World Cup, FIFA U-17 World Cup, Asian Games, Commonwealth Games, IPL, WPL, ISL, National Games, G-20, P-20, Bigg Boss, Indian Idol, and many more. The company also specializes in building cutting-edge studios for India's top news channels and executing large-scale, turnkey Systems Integration projects.

Expanding beyond broadcasting, ZOOM is rapidly growing its footprint in strategic technology sectors and next-generation engineering—delivering innovative solutions and forging key partnerships that drive technological and global progress. Be part of our mission-driven growth and help shape the future of technology.

Job Summary

We are seeking a highly motivated and experienced Tech Innovation Lead to drive next-generation product development and lead a multidisciplinary engineering team comprising Electronics, Mechanical, and Embedded Systems specialists. The ideal candidate is a strategic thinker and hands-on problem solver with a strong background in product innovation, systems engineering, and cross-functional team leadership.

This role requires a deep understanding of electronic hardware, embedded firmware, and mechanical design principles, along with a proven ability to coordinate complex R&D efforts from concept through to production. The Tech Innovation Lead will be responsible for aligning technical execution with business goals, fostering collaboration across teams, and ensuring the delivery of high-performance, manufacturable, and innovative solutions.

 Key Responsibilities

• Lead Cross-Functional Engineering Teams: Manage and coordinate the efforts of Electronics, Mechanical, and Embedded Systems teams to ensure alignment with project goals and technical excellence.
• Drive End-to-End Product Development: Oversee the design, development, and integration of complex, high-reliability systems from concept to production, ensuring performance, durability, and manufacturability.
• Strategic Technical Leadership: Define system architecture, guide technical decision-making, and ensure synergy across hardware, firmware, and mechanical domains.
• Innovation & Prototyping: Foster a culture of innovation by guiding rapid prototyping efforts, encouraging new ideas, and exploring emerging technologies for next-generation products.
• System Integration: Ensure seamless integration across electrical, mechanical, and embedded components, with a focus on IP-rated (IP65/IP68) ruggedized systems for harsh environments.
• Technical Oversight: Review and approve designs, schematics, PCB layouts, enclosure models, and firmware structures to maintain technical quality and compliance with industry standards.
• Testing & Validation: Oversee testing, validation, and debugging across all subsystems using industry-standard lab tools and methodologies.
• Project & Resource Management: Plan and manage resources, timelines, and deliverables across multiple concurrent R&D projects.
• Documentation & Compliance: Ensure high-quality documentation across all disciplines for manufacturing, compliance, assembly, and certification processes.
• Mentorship & Collaboration: Mentor engineers across disciplines, facilitate technical reviews, and drive collaboration to solve complex challenges in a fast-paced innovation environment.

Required Skills & Qualifications

Technical Expertise:

• Strong multidisciplinary background in electronics, embedded systems, and mechanical design, with the ability to lead and evaluate work across all three domains.
• Proficiency in electronic circuit design, simulation, and analysis using tools such as Altium Designer, OrCAD, or KiCAD.
• Deep understanding of PCB design, schematic capture, and multi-layer board development, including best practices for signal integrity, thermal management, and EMI/EMC compliance.
• Familiarity with embedded systems architecture, microcontroller platforms (e.g., STM32, PIC), and firmware development workflows.
• Knowledge of ruggedized mechanical design, including IP65/IP68-rated enclosures, thermal design, and environmental sealing.
• Proficiency in DFM (Design for Manufacturing) and DFA (Design for Assembly) across electrical and mechanical components.
• Hands-on experience with prototyping and validation, including the use of lab equipment such as oscilloscopes, logic analyzers, and environmental testing tools.
• Strong understanding of product lifecycle management (PLM), BOM management, and technical documentation processes.

Leadership & Communication:

• Proven ability to lead cross-functional engineering teams, drive collaboration, and manage complex technical programs.
• Excellent project planning, resource management, and decision-making skills.
• Strong verbal and written communication skills for cross-disciplinary coordination, reporting, and documentation.
• Comfortable presenting technical concepts to stakeholders, clients, and executive leadership.

Soft Skills

·        Strategic thinking and analytical mindset to solve complex, cross-disciplinary R&D challenges and guide teams toward innovative, high-impact solutions.

·        Creative leadership with a strong drive for innovation across electronics, embedded systems, and mechanical design domains.

·        Excellent communication and interpersonal skills to effectively lead and align diverse engineering teams and communicate with stakeholders at all levels.

·        High attention to detail, ensuring technical accuracy and design integrity across all phases of product development.

·        Strong organizational and time management abilities to balance multiple priorities, manage project timelines, and drive fast-paced innovation.

·        Collaborative mindset to foster a culture of teamwork, continuous improvement, and knowledge sharing within and across departments.

Educational & Other Qualifications

• Bachelor's or Master's degree in Electronics Engineering, Mechanical Engineering, Embedded Systems, Mechatronics, or a related technical field.
• Additional certifications in product design, embedded systems, systems engineering, or project management (e.g., PMP, Six Sigma, CSWP, ARM Certification) are a strong advantage.
• Prior experience in defence, industrial, or high-reliability product development involving integrated hardware, firmware, and mechanical systems is highly desirable.
• Minimum of 15 years of progressive engineering experience, with at least 7–10 years in a technical leadership or managerial role overseeing cross-functional engineering teams.
• Demonstrated ability to lead multidisciplinary R&D projects, drive innovation, and deliver complex products from concept to commercialization.
• Strong understanding of product development lifecycle, design validation, and system integration practices across engineering domains.

Why Join Us?

• Competitive salary and benefits
• Opportunities for professional growth and advancement
• Collaborative and innovative work culture
• Exposure to cutting-edge technologies and projects

How to Apply:

Interested candidates may send their CV along with cover letter to with the subject line:

"Application for Tech Innovation Lead" latest by 17 September 2025. 

Note: Only selected candidates will be contacted.