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3D-IC Application Engineer
3 months ago
Job Family: Sales
Req ID: 433068
Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.
About the role:
As an Applications engineer with Siemens EDA Technology Solutions Sales, you will support consultative sales efforts at the world’s leading semiconductor and electronic equipment manufacturers.
As an Applications Engineer at Siemens EDA, your primary responsibility is to secure technical design wins for Siemens EDA's product and service offerings. Specifically, you will be responsible for technical wins with the industry leading solutions Xpedition Substrate Integrator, Calibre, Tessent, Avatar, and other product families. Responsible activities will include delivery of technical presentations, conducting product demonstrations and benchmarks, and participation in development of solutions and account strategies leading to market share gains for Siemens. This position is also expected to help architect and prototype Siemens EDA’s emerging 3DIC solution through the development of flows and integration scripts to link tools into a solution.
Job Qualifications
B.tec/M.tech with 10+ years design experience. Significant experience in advanced IC and/or interposer design, experience with IC Packaging design is a plus. Necessary technical skills include satisfying many of these areas:
Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is required.
Familiarity with Package / Interposer planning solutions (Siemens XSI, Cadence OrbitIO, Synopsys 3DIC Compiler, Excel) is preferred.
Familiarity with Package Design (Cadence APD/SiP, Mentor Xpedition) is desired.
Practical experience with IC P&R tools for Silicon Interposer design is a highly desired.
Experience with one or more of the following tools: Avatar (Apogee), Mentor (Olympus-SoC), Synopsys (IC Compiler, Physical Compiler, Custom Compiler) and Cadence (SoC Encounter, Innovus, Virtuoso) preferred.
Understanding of ASIC design methodology from RTL Synthesis to Physical Implementation phases; Netlist-to-GDS flow expertise obtained through benchmark, evaluation or production (tape-out) of complex ASIC designs is a plus.
Familiarity with 2.5D and 3D solutions (TSMC InFO, CoWoS, GF GF32, ASE FoCUS, Amkor SWIFT, Samsung MDI, etc.).
Chiplet based design methodologies.
Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions is a highly desirable.
Familiarity with IC analysis tools such as Bluewave, Ansys HFSS and Redhawk, Cadence Voltus, or Synopsys PrimeTime is a plus.
Above average competency with Microsoft Word, Excel, and PowerPoint.
Scripting/Programming: Python, Tcl, Perl, or similar languages.
Working OS knowledge of Windows and Linux.
Prior experience as an Applications Engineer is preferred.
Preferred location: Bangalore
The ideal candidate will:
Possess a passion to learn and perform at the cutting edge of technology;
Have a desire to broaden exposure to the business aspects of the technical design world;
Enjoy contributing to the success of a great team;
Be able to work independently with minimal supervision.
Effectively influence people at any level;
Enjoy helping and motivating others to be successful.
Demonstrated ability to build strong rapport and credibility with customer organizations while maintaining a company internal network of contacts.
Have the capability to work independently with minimal direction and supervision.
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