Lead Electro Mechanical Packaging Design

2 weeks ago

Bengaluru, India Boeing Full time

Job Description

Qualifications:

Job Title: Lead Electro Mechanical Packaging Design & Analysis Engineer

Overview

Boeing is the world’s largest (Per Boeing LinkedIn page) aerospace company and a leading provider of commercial airplanes, defense, space, and security systems, and global services. Building on a legacy of over a century of innovation and leadership, Boeing continues to lead the way in technology and innovation, customer delivery, and investment in its people and future growth of aerospace.

In India, Boeing has been a strong partner to the Indian aerospace and defense sectors for more than 75 years. People at Boeing have been supporting mission readiness and modernization of India’s defense forces, and enabling connected, safer, and smarter flying experiences, in the sky, in the seas, and in space.

Technology for today and tomorrow

The Boeing India Engineering & Technology Center (BIETC) is a 3000+ diverse engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace.

People-driven culture

At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring diverse perspectives and thoughts – enabling every voice to be heard and every perspective to be respected. No matter where or how our teammates work, we are committed to positively shaping people’s careers and being thoughtful about employee wellbeing.

At Boeing, we are inclusive, diverse, and transformative.

With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace.

Position Overview

The Boeing India Engineering and Technology Center (BIETC) is looking for a Electronics Packaging Design & Analysis Engineer for a key role in development of a growing business unit. The position will be a hands-on technical role with responsibility ranging from printed circuit board design requirements, chassis design and development, thermal, structural, fatigue and materials selection, detailed design, documentation and analysis. The successful candidate should have a track record of demonstrated successes from previous work assignments.

Position Responsibilities:

Working on Electronic Line Replaceable Unit design & development for complex electro-mechanical System and components Analyzing Customer & System Requirements to develop thermal mechanical design concepts and printed circuit design approach for various avionics LRUs. Ability to perform design calculations to support in developing mechanical design concepts Perform preliminary as well as detailed level thermal analysis for steady state and transient Cases. Validate thermal analysis using a mixture of hand calculations and lab testing using prototypes. Validation of Thermal Analysis results using enclosure/ chassis, replicating power dissipation values. Exposure and thorough understanding on Air Transport Avionics Equipment Interfaces, ARINC Specification 600-20. Exposure on working on Heat pipes and their design considerations in thermal analysis Should be able to provide thermal solution and produce report, work with Vendor for Sourced items Identifying and tracking technical performance metrics to measure progress and ensure compliance with program requirements. Collaborating & communicating with cross functional teams and all stakeholders, especially electronics circuit designers and manufacturing engineers to ensure that the hardware meets imposed customer and derived requirements in compliance to avionics standard and regulations. Providing technical guidance and mentoring team during project execution. Executing end-to-end project management, including configuration management and change control. Represent Mechanical Engineering in program review meetings, design reviews, customer meetings, audits and other activities. Must be able to work well with domestic and global teams from a modern innovative and collaborative environment. Train and mentor other engineers while managing one or more projects. Strong problem-solving skills and the ability to proactively think out of the box preferred. Adapt to an innovation driven culture.

Basic Qualifications (Required Skills/Experience)

Required bachelor or master's degree. Good experience in performing thermal analysis for micro-electronic packages, board level and system level cooling. Must understand the complete product development lifecycle, capture requirements and provide technical guidance and decisions. Experience in Mechanical Chassis design (End-to-End) for Rugged/Sheet metal LRU and test equipment. Experience in Heat Sink Design, Fan Selection, TIM selection, design for heat pipes, liquid cooling. Good understanding of standard micro-electronic packages used in Printed Circuit Board assemblies. Good understanding of EMI/EMC considerations for electronic packaging. Experience in validating thermal analysis during lab tests and correlating test and analysis data.  Experience with high reliability of electronic component selection and design for reliability. Understanding of configuration management, requirements traceability (DOORS) and related processes. Experience in Aerospace Material Selection, Manufacturing processes and Finish. Experience in Aerospace - DO-160 and MIL-STD-810 is required.  Strong technical team leadership and mentoring skills. Ability to coordinate multi-discipline team. Experience with preparing well-organized reports, concise but complete presentations. Experience in using Engineering CFD design tool – FloTherm, Fluent, Icepak, Sherlock.

Typical Education & Experience:

Mechanical Engineering degree and 12+ years or Master degree with 11+ years of related work experience.

Relocation:

This position offers relocation based on candidate eligibility.

Boeing is the world's largest aerospace company and leading manufacturer of commercial airplanes and defense, space and security systems. We are engineers and technicians. Skilled scientists and thinkers. Bold innovators and dreamers. Join us, and you can build something better for yourself, for our customers and for the world.

Relocation:

Relocation is available for eligible candidates, if authorized

Export Control Requirement:

Not an export control position

Safety Sensitive:

This is not a safety sensitive position

Contingent Upon Award Program

This position is not contingent upon program award

Experience Level:

Individual Contributor - 4

Job Type:

Regular

Job Code:

6G5BI4 (63B)

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