CAD Engineer, Package Design
4 weeks ago
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR52669 CAD Engineer, Package DesignAs CAD Engineer at Micron Technology, you will be responsible for supporting Global Design, Simulation and Substrate teams through preparing best in class IC package drawings to meet with global assembly & test standards. This position would also ensure to follow the latest drafting standards (ASME / JEDEC), GD&T rules & Micron internal standards during assembly drawing preparation.
Roles & Responsibilities includes but are not limited to.
Create 2D & 3D drawings for the IC Packages using CAD software (Preferably Auto CAD & Autodesk Inventor) Create and Modify IC Package drawings , Package Architecture Drawings, Wire Bond Diagrams, Strip Outline, Package Outline, Marketing, Assembly marking, Lid, Stiffeners, Interposers and Other miscellaneous manufacturing drawings. Review Assembly Drawing Request information (ADR/ECN) from Counterpart & should be able to propose amendment if required. Review drawing quality and Perform peer check with standard drawing checklist. Strong Knowledge on NPI process & Product life cycle management through a notable PLM (Preferably Teamcenter) Knowledge on Cadence allegro software is an added advantage. Proficiency in Engineering Change Management Strong knowledge on Geometrical dimensioning & tolerancing (GD&T) methodologies Understand counterpart requirements and should be able manage tasks individually strong communication (oral and written) skills.Qualifications & Skills Required
Bachelor’s degree in mechanical or electrical engineering. 2 to 4 years of hands-on experience in Engineering Drawing/Modelling through a notable software (Preferably Auto CAD or Auto desk inventor) Good knowledge on Engineering Change notice (ECN) & Engineering Change Request (ECR) And their implementation process through notable PLM (Preferably Teamcenter) Preferred to have a background of semiconductor packaging & its associated CAD skills. Demonstrated ability to effectively present to both small and large groups. Basic knowledge on IT/CAD Automation techniques for the productivity improvements Strong analytical, written, and verbal communication, and organizational skills. Strong Team player & willing to help peers as needed.-
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