Ciliconchip Chief Technical Officer

Ciliconchip Chief Technical Officer

Experience: 20+ Years

Location: Bangalore

Role Overview

The Chief Technical Officer (CTO) will define and lead the company's technology vision, architecture, and innovation roadmap in Mixed-Signal Analog IP development, with focus areas spanning power management, UCIe interfaces, memory, and sensor technologies. This leadership role will drive R&D excellence, IP innovation, and engineering capability across global design teams.

Key Responsibilities

1. Technology Strategy & Vision

• Define and own the companys Mixed-Signal Analog IP technology roadmap, aligning it with business strategy and market direction.
• Identify emerging analog and mixed-signal trends (UCIe, chiplet integration, low-power and high-speed analog architectures) that can create competitive differentiation.
• Establish and nurture strategic partnerships with foundries, EDA vendors, universities, and ecosystem players to strengthen IP innovation.
• Guide R&D in advanced design methodologies, reusable IP frameworks, and next-generation process readiness.

2. Engineering Leadership

• Oversee all engineering functions Analog/Mixed-Signal Design, Circuit Verification, Layout, Validation, and Integration.
• Set technical standards, design quality metrics, and best practices across all IP development programs.
• Ensure predictable execution and delivery of high-performance, low-power Mixed-Signal IPs.
• Drive PPA (Power, Performance, Area) optimization, design reusability, and automation in design and verification flows.

3. IP Development & Productization

• Drive first-silicon success and productization of advanced Mixed-Signal IPs across power, UCIe, memory, and sensor domains.
• Architect reusable IP cores, subsystems, and platforms to accelerate future product and customer integration cycles.
• Oversee technology evaluation for EDA tools, analog/mixed-signal design kits (PDKs), libraries, and process migrations.
• Review IP specifications to ensure feasibility, scalability, manufacturability, and compliance with integration standards.

4. Innovation & R&D

• Lead advanced R&D initiatives in emerging domains such as low-power architectures, high-speed interfaces, and AI-assisted design automation.
• Sponsor internal innovation programs and IP filings, fostering a culture of technical excellence and experimentation.
• Drive internal architecture forums, design councils, and cross-functional technical reviews to accelerate learning and innovation.

5. Talent Development & Organization Building

• Mentor and develop senior technical leaders including Directors, Fellows, and Principal Engineers across analog, mixed-signal, and IP disciplines.
• Foster a high-performance, innovation-driven culture emphasizing accountability and technical depth.
• Partner with HR to define technical career ladders, learning frameworks, and university collaboration programs to build a sustainable talent pipeline.

6. Customer & Ecosystem Engagement

• Serve as the companys technical ambassador with customers, partners, and industry forums.
• Translate customer requirements into scalable, IP-level technical solutions and roadmaps.
• Engage in strategic business reviews, co-development initiatives, and customer engagements to ensure alignment with market needs.
• Represent the company at industry conferences and technology consortia, showcasing IP leadership and innovation.

7. Governance & Risk Management

• Ensure IP protection, design security, and compliance across all programs.
• Define and enforce technical governance frameworks, including design reviews and quality audits.
• Mitigate risks through robust validation, simulation coverage, and silicon correlation strategies.

Qualifications

Minimum Requirements

• B.E./B.Tech/M.Tech/Ph.D. in Electrical, Electronics, or Microelectronics Engineering.
• 20+ years of experience in Analog/Mixed-Signal IP design and development, with at least 10 years in senior leadership roles.
• Proven track record of leading large, multi-disciplinary engineering teams across global sites.
• Deep hands-on expertise in power management circuits, high-speed interfaces (UCIe), memory IPs, and sensor integration.
• Strong understanding of EDA tool chains, design flows, process technologies, and silicon manufacturing.
• Demonstrated success in building world-class engineering teams and delivering IP innovation at scale.

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