APD Package Design
2 days ago
Job Description:
Role: Cadence APD Package Design
Experience: 5+ Years
Location: Bangalore
- IC Package Design Engineer
- Experience with Cadence APD IC Package Design experience with Cadence APD
- Good understanding of package/substrate design and package assembly rules related to flip chip designs.
- Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
- Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies.
- Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES.
- Good Exposure to Stackup design, DFM, DFA rules and adherence.
- Should have expertise in constraint setting in layout tool.
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