Packaging Design

3 days ago

Bengaluru Karnataka, India Elfonze Technologies Full time

**Job Information**:
Date Opened
- 10/14/2024Job Type
- Full timeIndustry
- SemiconductorCity
- bengaluruState/Province
- karnataka bengaluruCountry
- IndiaZip/Postal Code
- 530068**Job description**:
**Requirements**:

Strong Electrical engineering fundamentals and exposure on complete PCB Layout / Package Design cycle from Conceptualization to realization
- Proven experience in designing mock up modules in realizing the Package Design and working experience with EDA tools such as Cadence Allegro, OrCAD Schematic Capture etc., and industry popular packaging design tools.
- Very Good experience in managing a team of CAD engineers and guide them to ensure end goal with quality deliverables.
- Experience in designing complex Hi-Speed board layout designs involving HDI with buried Vias and Any layer to any layer interconnect technologies.
- Familiar with routing techniques that involves DDR-2, DDR-3, SATA, USB 2.0, USB 3.0, Display Port, PCI-e, GB-Ethernet (10BASE-T / 100BASE-TX/1000BASE-T) etc.,
- Proficiency in advanced packaging design concepts (such as 2D, 2.5D, 3D and CoWos etc.,) with proven track record of delivering quality outputs.
- Good mentoring, Communication Skill and Team work

**Responsibilities**:

- Work with marketing and product development teams to understand the target audience, brand identity, and product requirements
- Present design solutions, concepts, and ideas to various stakeholders and incorporate feedback into the final design
- Keep up with consumer and market trends for packaging materials
- Responsible for designing and implementing reliable CAD designs for Layout & IC Packaging with hi-speed interface standards
- Architect the Package design as per the Client requirements and coordination to get it in physical form mentoring execution team
- Understand the impact of the packaging, such as the cost per unit of different packaging materials followed by creation of physical designs for packages and modules for chips such as memory, RF, cellular, and SoC
- Guiding the team leads / managers and identify Training Requirements for the team members to achieve the goal resulting in success of the organization
- The job involves co-ordination with Device packaging vendors, to ensure error free package design.
- Analyze existing packaging and come up with a new way to sell more products at a lower production price point

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