Package Design Architect

** Roles and Responsibilities**
- Responsible for architecting package for next-gen automotive products encompassing advanced packaging techniques (2.5D/3D).
- Lead the SOC-silicon die/chiplets co-optimization for best-in-class performance, power and reliability.
- Drive package design workgroup and ensure collaboration across all stakeholder teams such as ATTD, SoC, Platform, Electrical, Thermal/Mechanical and others.
- Take ownership for entire package design deliverables (such as footprint, ballmap, layout) and ensure project milestones are met.
- Provide inputs and drive solutions during technical readiness.
- Analyze failures; Work with the stakeholders to debug issues and provide solutions.
- Mentor and lead design engineers to drive package design as per established and/or provided guidelines.

**Qualifications**:** Qualifications**:

- Master's Degree in Electrical Engineering with 15+ years of relevant industry experience or PhD in Electrical Engineering with 8-10 years of relevant experience.
- Demonstrated expertise in advance silicon packaging technologies such as MCM, 2.5D (various D2D technologies) and 3D (Foveros) packaging technology.
- Complete design cycle experience with package design and tape-out for at least 2 designs.
- Experience with package design tools such as Xpedition, ADP, Virtuoso and other similar design tools.
- Expertise with design guidelines / design rules concerning various aspects like stackup, materials, HSIO / memory routing, PDN placement, Thermal/Mechanical constraints and KOZ, D2D guidelines, Foveros and others.
- Innovative thinker, able to propose/drive solutions to tough product definition challenges to meet performance and functional requirements.
- Automotive domain experience, PCB/system design experience will be added advantage.
- Ability to communicate effectively across multiple disciplines, such as silicon design, board design, mechanical design and electrical domains.

Great team player, willing to learn and flexible.

**Inside this Business Group**:
Corporate Strategy Office is chartered to support the executive office in driving corporate initiatives, including near and long-term strategy, major cross-group decision making and ensuring cross-company alignment. To deliver to that mission, the team owns shaping, driving and synthesizing insights to directionally orient trends as well as long range strategic planning/visioning, cross company alignment and greenfield innovation. Communications are essential to drive alignment so there is a focus on communications, community and acumen development. The team is ccommitted to ensuring that Intel efforts are aligned to, and actively driving success toward the most impactful business strategies.

**Posting Statement**:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

**Benefits**:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

**Working Model**:
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. **In certain circumstances the work model may change to accommodate business needs.**
JobType

Hybrid