Memory Package Design Expert
1 week ago
Transforming the Future of Memory Packaging
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence.
Key Responsibilities:
- Design and execute high-quality DRAM packages on time.
- Collaborate with customers, internal teams, and ecosystem partners to develop innovative packaging solutions.
- Drive package design innovations and improvements.
- Support design setup, rules, and routing methodologies for advanced processes.
- Participate in package and DFMEA reviews.
- Generate and update assembly documents and provide drafting support.
- Work with suppliers and partners to meet packaging requirements.
- Conduct feasibility studies and assess designs for manufacturability and reliability.
- Support a data-driven culture and establish operational metrics.
- Lead package and DFM reviews and design setup.
- Engage with customers and partners to propose package solutions.
- Support package technology development, including material selection and process development.
- Track and drive program landmarks.
- Support packaging IP development.
- Provide design support for thermal/mechanical/electrical simulation analysis.
Qualifications:
- Mtech in electrical engineering or a related field.
- Three or more years of industry experience in advanced memory substrate design, design optimization, and tool usage.
- Outstanding computer skills and MS Office competence.
- A keen eye for detail and accuracy.
- Effective interpersonal skills and a global perspective.
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