Memory Package Design Expert

1 week ago


Hyderabad, Telangana, India Micron Full time

Transforming the Future of Memory Packaging

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence.

Key Responsibilities:

  • Design and execute high-quality DRAM packages on time.
  • Collaborate with customers, internal teams, and ecosystem partners to develop innovative packaging solutions.
  • Drive package design innovations and improvements.
  • Support design setup, rules, and routing methodologies for advanced processes.
  • Participate in package and DFMEA reviews.
  • Generate and update assembly documents and provide drafting support.
  • Work with suppliers and partners to meet packaging requirements.
  • Conduct feasibility studies and assess designs for manufacturability and reliability.
  • Support a data-driven culture and establish operational metrics.
  • Lead package and DFM reviews and design setup.
  • Engage with customers and partners to propose package solutions.
  • Support package technology development, including material selection and process development.
  • Track and drive program landmarks.
  • Support packaging IP development.
  • Provide design support for thermal/mechanical/electrical simulation analysis.

Qualifications:

  • Mtech in electrical engineering or a related field.
  • Three or more years of industry experience in advanced memory substrate design, design optimization, and tool usage.
  • Outstanding computer skills and MS Office competence.
  • A keen eye for detail and accuracy.
  • Effective interpersonal skills and a global perspective.


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