Package Design Engineer

4 weeks ago

Hyderabad, Telangana, India Micron Full time

Transforming Memory Solutions

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence.

As a Package Design Engineer, you will play a crucial role in executing DRAM designs on time with 100% quality, supporting the design of highly integrated packages for optimal electrical performance, manufacturability, and reliability.

Key Responsibilities:

  • Design and execute DRAM packages with 100% quality.
  • Support the design of highly integrated packages for optimal electrical performance, manufacturability, and reliability.
  • Collaborate with customers, internal process design teams, OSATs, and other ecosystem partners to drive innovations into future memory generations.
  • Set up designs, rules, and routing methodologies for advanced processes.
  • Support package and DFMEA reviews with assembly engineering and subcon teams.
  • Generate and update assembly documents in database.
  • Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
  • Work with SBT suppliers, OSATs, and other ecosystem partners to meet their requirements with packaging solutions.
  • Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
  • Support a data-driven culture, operational excellence, and establishing processes and operational metrics.
  • Lead package and DFM reviews and design setup.
  • Engage with key Business Unit customers and assembly subcontractor partners to propose package solutions that meet customer and/or market needs.
  • Support package technology development, including material selection, process development, DOEs, and related activities.
  • Track and drive program landmarks to ensure timely development execution.
  • Support packaging IP development.
  • Provide design support for thermal/mechanical/electrical simulation analysis.
  • Support and supply to the design group's continuous improvement efforts.

Qualifications:

  • Mtech in electrical engineering (preferred), Electronics or a related field that covers a wide range of topics in mechanical engineering, materials science, or other interdisciplinary areas.
  • Three or more years (preferably 5+ years) of industry experience within the following areas: Advanced Memory Substrate Design for flip chip and wire bond interconnects, Design optimization for Signal and Power Integrity, Cadence (Allegro Package Designer+), Siemens/MentorGraphics (Xpedition tool suite), AutoCAD (Autodesk Mechanical) tools, Chip Package Interaction (CPI).
  • Outstanding computer skills and MS Office competence.
  • A keen eye for detail and accuracy.
  • Effective interpersonal skills, both oral and written.
  • A global perspective and the ability to work in a multicultural environment.
  • Ability to prioritize and manage numerous projects successfully.
  • Willingness to travel as needed.

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