Senior Process Engineer – Advanced Semiconductor Assembly

3 days ago


Lucknow, Uttar Pradesh, India beBeeEngineer Full time ₹ 30,00,000 - ₹ 35,00,000
Job Opportunity

This position entails driving process excellence in assembly operations, optimizing yields, and ensuring smooth ramp-up of new technologies.

  • Lead the development and optimization of processes for semiconductor packaging (Die Attach, Wire Bonding, Molding, Wafer Bumping, Singulation, Underfill, Encapsulation, etc.).
  • Monitor key process parameters, identify bottlenecks, and drive yield improvements.
  • Support New Product Introduction from customer design handover to stable mass production.

Mentor junior engineers and technicians on best practices in OSAT process engineering.

Familiarity with Statistical Process Control, Design of Experiments, Failure Mode Effects Analysis, Six Sigma, Lean Manufacturing methodologies is expected.

  • Bachelor's / Master's degree in Mechanical, Electronics, Electrical, Materials, or related Engineering field.
  • 8–12 years of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
  • Strong hands-on expertise in at least one core process area (Wire Bonding, Die Attach, Molding, WLP, Fan-out, etc.).

Excellent analytical, problem-solving, and communication skills are required.

Key Responsibilities

The successful candidate will be responsible for setting up one of India's finest OSAT facilities, focused on advanced semiconductor assembly, packaging, and testing.



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