OPC (Optical Proximity Correction) Head

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components. Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence. Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’ Responsibilities: To lead the Optical Proximity Correction (OPC) team in the 300mm wafer fab located in Dholera, India. To recruit, train and enable them for the OPC model development Coach, mentor team members and develop high performance, customer oriented culture. Work with Technology Transfer partner and understand / transfer OPC methodology to Dholera fab. Develop OPC roadmap and work with cross functional teams like Technology Development, Design Enablement and Lithography / Etch teams on OPC and develop models for different tool types and lithography conditions across multitude of technology nodes. Assist Business team in performance targets and cost analysis Work with TD teams on test chip layouts. Responsible for meeting project performance requirements Competitor benchmarking and Roadmap development Presentation to internal and customer senior executives Travel – as necessary Essential Attributes: Ability to work with cross functional teams Able to lead the OPC team, set direction, possess leadership traits, Self-motivated with a strong drive to win. Team player with the ability to work across diverse cross-functional teams spread across the world. You’re inclusive, adapting your style to the situation and diverse global norms of our people. An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding. You’re collaborative, building relationships, humbly offering support and openly welcoming approaches. Innovative and creative, you proactively explore new ideas and adapt quickly to change. Qualifications: B.S. in Electrical Engineering, Engineering Physics, Materials Science or equivalent; Masters & PhD holders preferred. Previously developed / led OPC teams on multiple technology nodes is preferred. Strong understanding of Semiconductor process, Customer design elements, Lithography process are required. Collaborative and Cross functional working with internal and external customers. Work seamlessly with Technology Development team, Design Enablement team, Lithography / Etch teams and develop Computational OPC solutions. To conceptualize thru pitch structures, Reticle Enhancement structures and work with CAD layout teams to develop test chip. Run silicon, collect data and develop OPC models for multitude of technology nodes. Knowledge of optical effects (Refraction, diffraction, flare, AR etc.,) required. Litho / etch CD, overlay data collection and analyze for model based OPC solutions. Knowledge of design enablement and tape-out systems and how OPC is part of the tape-out process. Familiarity with OPC modelling and rule setting processes Innovation mindset Desired Experience Level: > 10 years experience in the Optical Proximity Correction area (OPC) area Knowledge of Lithography process, tools and patterning aspects. End to end knowledge of OPC modelling and application aspects. Successful application of developed OPC models in Production environment & resolved yield limiting factors. Knowledge of CAD tools on OPC modelling and concepts. Knowledge of Design of Experiments, Data Analytics, JMP, Anova and statistical analysis.