L&T Semiconductor Technologies | Package Design Lead
4 days ago
Basic Qualifications
- BTech/Mtech in Engineering Degree required (Electrical, Materials Science, Physics, etc.).
- Minimum of 8 years of experience with Cadence APD/SIP or Mentor Xpedition.
- Able to design and layout a standard TSOP, QFP/QFN, FCBGA/FCCSP, Multi-chip, interposer based 2.5D or heterogeneous package design package from start to tape-out independently.
- Familiar with BGA package substrate technologies and assembly process. Good understanding of BOM, stackups, high speed design rules and guidelines.
- Good understanding of Co-design with top fit and bottom fit studies to enable advanced package design
- Working knowledge of package reliability, SI/PI, Thermal mechanical is a plus.
- Entrepreneurial, open-mind behaviour and hands-on work ethic with the ability to prioritize a dynamic list of multiple tasks.
- Excellent teamwork and collaboration, thriving in a dynamic environment, and possessing strong communication skills to effectively work with cross-functional teams and adapt to ever-changing situations.
Required Experience
- Proficiency in Cadence APD/SiP or Mentor Xpedition is a must. Able to design small TSOP to large body BGAs from concept to tape out.
- Good understanding of BGA package BOM and integration into APD layout and routing design rules.
- Setup layer-stackup, padstacks, design constraints (physical and electrical), SMT components, optimize design based on SI/PI simulation result and design reviews. Understanding of transmission line theory and SI/PI fundamentals is a plus.
- Conduct DRC/DRV/LVS/DFM checks with given tools, perform design review reporting, and Gerber and artwork releasing. Generate all required package design documentations.
- Perform feasibility studies such as fan-out, mockup design, layer & package size reduction, etc.
- Basic knowledge of packages manufacturing flow, supply chain, reliability, risk management and failure analysis.
- Drive new design flow development in APD with given new package types or technologies. Drive methodology and productivity improvements in package design by working with vendors or scripting.
- Proficiency in scripting languages for design and reporting automation is a plus.
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Package design lead
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Bangalore, India L&T Semiconductor Technologies Full timeBasic Qualifications BTech/Mtech in Engineering Degree required (Electrical, Materials Science, Physics, etc.). Minimum of 8 years of experience with Cadence APD/SIP or Mentor Xpedition. Able to design and layout a standard TSOP, QFP/QFN, FCBGA/FCCSP, Multi-chip, interposer based 2.5 D or heterogeneous package design package from start to tape-out...
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