R&D – Head OTP/MTP Technologies
2 months ago
Integration responsibilities to add
OTP and MTP Features
to 28-110nm platform technologies, with future extension into FinFet nodes. Work with IP providers, as needed, to implement these features.Design and Layout of test chips and macros
to aid in device/technology optimization, rel assessment and SPICE model extractionEnd to end
Project Management
from initial project justification to final qualification and yield ramp with responsibilities for achieving desired
performance, quality/yield, schedule and cost targets.Build and lead a cross functional team across diverse geographiesBuild strong customer relationships based on confidence in TEPL technical capabilitiesCompetitor benchmarking; ownership of technology roadmapPresentation to internal and customer senior executivesPossible involvement in OTP developmentTravel (few weeks per quarter)
Ability to manage, mentor, and lead a team of highly motivated professionals.Able to work independently, self-motivated with a strong drive to win.Team player with the ability to work across diverse cross-functional teams spread across the world.Leadership skills to influence all levels of the organization.You’re inclusive, adapting your style to the situation and diverse global norms of our people.An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.Innovative and creative, you proactively explore new ideas and adapt quickly to change.
M.S or PhD in Electrical Engineering, Materials Science or equivalentStrong understanding of CMOS and eNVM
device physics ,
process modules , yield improvement, failure mechanisms, analytical techniques (physical and electrical)Deep understanding of
OTP fuse and anti-fuse technologies
along with
charge trap and emerging memory technologies
for MTP applications. Understands pros and cons of different approaches and can select best options for give technology and applicationAbility to
layout test chips
and
design macros
(or provide specifications to IP houses for them to design the macros)Understanding of technology parameters and figures of merit ( bit cell size, macro size, endurance, retention, power, latency, mask count , etc); experience in achieving competitive performanceProven track record in delivering these technologies into volume manufacturingAbility to lead cross-functional teams and achieve project completion within timeline and cost targetsAbility to work across different cultures and geographiesGood team playerInnovation and competitive mindset
15+ years experience in the semiconductor industryProven track record of successfully developing new technologies into high volume productionProven problem solving skills using design of experiments and analytical tools
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