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Thermomechanical Design Engineer

2 months ago

bangalore, India Texas Instruments Full time
About the job
We have an exciting opportunity for a Thermomechanical Design Engineer to join our Gallium Nitride (GaN) Product Line in the High Voltage Power (HVP) Business Unit in Analog Power Products. The HVP team in TI develops power solutions for a wide array of end equipments, with several hundreds of volts of withstand capability. This team in TI offers one of the world's largest comprehensive portfolios of high-performance AC/DC and isolated DC/DC controllers, converters and modules, as well as GaN integrated products, with a wide range of power topology options.
As Thermomechanical Design Engineer, you will be responsible for the mechanical & thermal design of PCBs, new packages and products within the HVP team. You will collaborate with systems, applications and design to define & develop power stages and power modules, involving GaN & Si ICs. These products are used in complex power electronics designs where you will be stretching the limits of power density, where managing mechanical stress, thermals & electro-magnetic interference (EMI) are key. You will also work with program management, product & test teams as well as internal & external manufacturing partners to release to market & ramp these new products in high-volume production. During ramp, you will also support factories driving technical innovation & continuous improvement activities associated with reducing cost & improving reliability.
HVP is an exciting business that is driving significant innovation for our customers & offers huge growth potential for TI. As with any new technology, we have significant challenges to go and solve. If you’re looking for a fast-paced, challenging role in an exciting ‘startup-like’ eco-system, which will have an impact on TI for the long-term then this position as Thermomechanical Design Engineer for HVP-GaN may be right for you
Minimum requirements:
Bachelor’s degree in Electrical Engineering or equivalent with a minimum of 5 years’ experience
Structural and thermal analysis in tools like ANSYS
Proficiency with Computer Aided Design (CAD) tools – Pro/E or CREO preferably
Experience with applied Geometric Dimensioning & Tolerance
Surface mount Circuit Card Assembly design and implementation
Preferred Qualifications:
Experience with complex power module projects eg. server and telecom brick modules
Experience in factory support environment
Experience with power electronics
Demonstrated strategic thinking & decision-making skills
Demonstrated analytical and problem-solving skills
Strong communication & active listening skills
Ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and prioritize tasks to deliver results