
IC Package Design Eng
2 weeks ago
Role & responsibilities
- IC Package Layout Design Engineer
- Experience with IC Package Layout Design using Cadence Allegro APD (will consider Mentor Graphics XPD, XSI tools experience also)
- Good understanding of package/substrate design and package assembly rules related to flip chip designs.
- Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage.
- Expertise in High-Speed Complex PCB and Package designs with HDI, Blind and Buried Via technologies.
- Hands-on expertise with PCB and Package layout designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES and Type C.
- Good Exposure to Stackup design, substrate DFM, DFA rules and adherence.
- Should have expertise in constraint setting in layout tool.
Preferred candidate profile
Experinec in IC Package Layout Design, Substrate Design, Flip Chip, Wire bond, Cadence APD (Primary), Mentor Graphics Expedition (Secondary). Cadence APD is Primary tool
-
IC Package Design Eng
4 days ago
Bengaluru, Karnataka, India HCLTech Full time ₹ 1,20,000 - ₹ 2,60,000 per yearRole & responsibilitiesIC Package Layout Design EngineerExperience with IC Package Layout Design using Cadence Allegro APD (will consider Mentor Graphics XPD, XSI tools experience also)Good understanding of package/substrate design and package assembly rules related to flip chip designs.Exposure to different package technologies such as MCM, flip chip / wire...
-
IC Package Design Engineer
2 weeks ago
Bengaluru, India DBSI Services Full timeSenior Engineer, Package Design – Bengaluru, KA- India Description: We are seeking aSenior Engineer, Package Designto work from our Milpitas, CA office. Responsibilities: The Package substrate design focus on signal and power integrities analyses as well as routing analyses. You will be reporting to the Director of Package Design (USA) and working very...
-
IC Package Design Engineer
6 days ago
Bengaluru, Karnataka, India DBSI Services Full time ₹ 12,00,000 - ₹ 36,00,000 per yearSenior Engineer, Package Design – Bengaluru, KA- IndiaDescription:We are seeking aSenior Engineer, Package Designto work from our Milpitas, CA office.Responsibilities:The Package substrate design focus on signal and power integrities analyses as well as routing analyses. You will be reporting to the Director of Package Design (USA) and working very closely...
-
IC- ANALOG DESIGN ENGINEER
3 days ago
Bengaluru, India TE Connectivity Full timeAt TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development,...
-
Print Packaging Designer
17 hours ago
Bengaluru, India oneandonly design Full time**PRINT & PACKAGING DESIGNER** Experience - 3+ yrs Location - Bangalore Notice Period - Immediate - 20 days - Designing graphic content, illustrations, and infographics. - Managing graphic designs from conception to delivery. - Review junior designer drafts to ensure quality. - Generating fresh concepts. - Ensuring brand consistency throughout various...
-
Chip Lead
2 weeks ago
Bengaluru, India Texas Instruments Full timeAbout the jobIf you are looking to join an ingenious, vigorous & ambitious team that consistently delivers groundbreaking technologies into the custom mobile electronics world, here is an opportunity for you!The Custom product business is delivering industry leading custom IC system solutions including display and touch power products, charger power...
-
Chip Lead
2 weeks ago
Bengaluru, India Texas Instruments Full timeAbout the job If you are looking to join an ingenious, vigorous & ambitious team that consistently delivers groundbreaking technologies into the custom mobile electronics world, here is an opportunity for you! The Custom product business is delivering industry leading custom IC system solutions including display and touch power products, charger power...
-
Physical Design Engineer
1 week ago
Bengaluru, Karnataka, India Eximietas Design Full time ₹ 20,00,000 - ₹ 25,00,000 per yearTitle: Physical Design EngineerExp: 5+Description:Hands-on experience in full-chip physical design. Strong expertise in EDA tools such as Cadence Innovus, Synopsys ICC2/Fusion Compiler, or equivalent. Proficiency in timing analysis and optimization using tools like PrimeTime. Experience with physical verification tools (e.g., Calibre, ICV) and signoff...
-
Packaging Development Manager
4 days ago
Bengaluru, Karnataka, India Dairy Classic Ice Creams Full time ₹ 5,00,000 - ₹ 15,00,000 per yearJOB DISCRIPTION JOB TITLE Packaging Development ManagerDEPARTMENT Product Innovation / Packaging R&DLOCATION BangaloreREPORTING TO COOROLE AND RESPONSIBILITIESDairy Day was started in 2002 by two veterans from the ice-cream industry, with a keen desire to chart their own course in a category they were deeply passionate about. Over the past 20 years, Dairy...
-
Packaging Development Manager
2 weeks ago
Bengaluru, India Dairy Classic Ice Creams Full timeJOB DISCRIPTION JOB TITLE Packaging Development Manager DEPARTMENT Product Innovation / Packaging R&D LOCATION Bangalore REPORTING TO COO ROLE AND RESPONSIBILITIES Dairy Day was started in 2002 by two veterans from the ice-cream industry, with a keen desire to chart their own course in a category they were deeply passionate about. Over the past 20 years,...