ISP Packaging Engineer

Roles: ISP Packaging Lead - OSAT Semiconductor Experience: 10-15 Yrs Education Qualification: Bachelor’s/Master’s in Mechanical, Electrical, or Electronics Engineering Job Description Experience in semiconductor packaging with hands-on experience in SMT and TLA line management Oversee SMT and TLA line operations at OSAT sites, ensuring process stability,...

Roles: ISP Packaging Lead - OSAT SemiconductorExperience: 10-15 YrsEducation Qualification: Bachelor’s/Master’s in Mechanical, Electrical, or Electronics EngineeringJob DescriptionExperience in semiconductor packaging with hands-on experience in SMT and TLA line managementOversee SMT and TLA line operations at OSAT sites, ensuring process stability,...

Roles: ISP Packaging Lead - OSAT SemiconductorExperience: 10-15 YrsEducation Qualification: Bachelor’s/Master’s in Mechanical, Electrical, or Electronics EngineeringJob DescriptionExperience in semiconductor packaging with hands-on experience in SMT and TLA line managementOversee SMT and TLA line operations at OSAT sites, ensuring process stability,...

Roles:ISP Packaging Lead - OSAT SemiconductorExperience:10-15 YrsEducation Qualification:Bachelor's/Master's in Mechanical, Electrical, or Electronics EngineeringJob DescriptionExperience in semiconductor packaging with hands-on experience in SMT and TLA line managementOversee SMT and TLA line operations at OSAT sites, ensuring process stability, yield, and...

Experience : 8+ YearsLocation : Assam, Jagiroad 1) Experience in semiconductor packaging quality area in an OSAT environment.2) Strong Knowledge of wire bonding, flip chip, and ISP technologies.3) Proficiency in Minitab, JMP, and other statistical analysis tools.4) Excellet problem-solving, documentation, and communication skills5) Experience with QFN, BGA,...

Experience : 8+ Years Location : Assam, Jagiroad 1) Experience in semiconductor packaging quality area in an OSAT environment. 2) Strong Knowledge of wire bonding, flip chip, and ISP technologies. 3) Proficiency in Minitab, JMP, and other statistical analysis tools. 4) Excellet problem-solving, documentation, and communication skills 5) Experience with QFN,...

Experience : 8+ Years Location : Assam, Jagiroad 1) Experience in semiconductor packaging quality area in an OSAT environment. 2) Strong Knowledge of wire bonding, flip chip, and ISP technologies. 3) Proficiency in Minitab, JMP, and other statistical analysis tools. 4) Excellet problem-solving, documentation, and communication skills 5) Experience with QFN,...

Position Overview: The Manufacturing Engineer will be responsible for overseeing and optimizing backend semiconductor manufacturing processes, including wire bonding, flip chip assembly, integrated system packaging, and testing. This role is critical in ensuring high-yield, cost-effective, and scalable production in a high-volume OSAT environment. The...

Location: TATA Semiconductor Assembly and Test, Jagiroad, IndiaPosition Overview:As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both...

Position Overview:The Manufacturing Engineer will be responsible for overseeing and optimizing backend semiconductor manufacturing processes, including wire bonding, flip chip assembly, integrated system packaging, and testing. This role is critical in ensuring high-yield, cost-effective, and scalable production in a high-volume OSAT environment. The...