Quality Lead

Experience : 8+ YearsLocation : Assam, Jagiroad 1) Experience in semiconductor packaging quality area in an OSAT environment.2) Strong Knowledge of wire bonding, flip chip, and ISP technologies.3) Proficiency in Minitab, JMP, and other statistical analysis tools.4) Excellet problem-solving, documentation, and communication skills5) Experience with QFN, BGA,...

Experience : 8+ Years Location : Assam, Jagiroad 1) Experience in semiconductor packaging quality area in an OSAT environment. 2) Strong Knowledge of wire bonding, flip chip, and ISP technologies. 3) Proficiency in Minitab, JMP, and other statistical analysis tools. 4) Excellet problem-solving, documentation, and communication skills 5) Experience with QFN,...

Location: TATA Semiconductor Assembly and Test, Jagiroad, India Position Overview: As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both...

Location: TATA Semiconductor Assembly and Test, Jagiroad, India Position Overview: As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both...

Location: TATA Semiconductor Assembly and Test, Jagiroad, India Position Overview: As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both...

PositionQuality and Impact Officer – As-Sweida (covering Sweida and supporting Daraa, and Rural Damascus as requested)Location(s)Syria – As-Sweida (covering Sweida and supporting Daraa, and Rural Damascus as requested)Reports toQuality and Impact Coordinator (day-to-day); Deputy Executive Director – Quality and Impact (overall)DurationOctober 2025 –...

Position Overview: The Manufacturing Engineer will be responsible for overseeing and optimizing backend semiconductor manufacturing processes, including wire bonding, flip chip assembly, integrated system packaging, and testing. This role is critical in ensuring high-yield, cost-effective, and scalable production in a high-volume OSAT environment. The...

Position Overview: The Manufacturing Engineer will be responsible for overseeing and optimizing backend semiconductor manufacturing processes, including wire bonding, flip chip assembly, integrated system packaging, and testing. This role is critical in ensuring high-yield, cost-effective, and scalable production in a high-volume OSAT environment. The...

About the Company:Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as...

About the Company:Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as...