SOC Thermal engineer

Qualcomm India Private Limited

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Job Function:

• SOC Thermal analysis methodology development: encompassing SoC, package and systems, for various Qualcomm products going into smartphones, laptops, automotives and virtual reality headsets.
• Developing strategies to predict and improve thermally constrained scores (AnTuTu/Geekbench) and also measure/tune it on post-Si platforms, including infrared imaging.
• Thermal measurement : The candidate will be responsible for improving thermal mitigation strategies through power and thermal management to achieve optimal system thermal performance.

Skills:

• Should possess strong analytical skills and mathematical modeling abilities.
• Knowledge of SOC stack up is must
• Good knowledge of scripting in PERL/Python required; some exposure to Machine Learning algorithms/frameworks will be a plus.
• Need to have thorough knowledge of heat transfer mechanisms and CFD.
• Proficiency with state-of-the-art thermal analysis tools – Ansys Icepak/Flotherm
• Thermal Measurement will be preferred skill

Experience: BE/ME graduates with 1 to 3 years of experience.

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