Process Quality Engineer

4 weeks ago


Guwahati, India Tata Electronics Full time

Location: TATA Semiconductor Assembly and Test, Jagiroad, IndiaPosition Overview:As a Process Engineer in an OSAT environment, you will play a pivotal role in developing, optimizing, and sustaining semiconductor packaging processes. You will be responsible for wire bonding, flip chip assembly, and integrated system packaging technologies, supporting both high-volume production and new product introductions (NPI). This role demands a strong technical foundation, hands-on experience with packaging equipment, and the ability to collaborate across cross-functional teams including R&D, quality, and customer engineering.Key Responsibilities:1. Process Development & OptimizationDesign and implement robust packaging processes including:Wire bonding (ball/wedge bonding, fine pitch, multi-row)Flip chip (underfill, reflow, thermal compression bonding)Integrated system packagingConduct DOE (Design of Experiments) to optimize process parameters for yield, reliability, and throughput.Develop and maintain process documentation: SOPs, control plans, FMEAs, build sheets etc.2. Manufacturing SupportProvide real-time support to production lines to resolve process-related issues.Monitor process KPIs such as yield, cycle time, defect rates, and equipment uptime.Lead root cause analysis and implement corrective actions for maverick lots and customer returns.3. New Product Introduction (NPI)Collaborate with customer engineering and R&D teams to



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