Technical Lead – Mechanical

2 weeks ago

Bengaluru, India CoreEL Technologies Full time

Professional Skills:
• Minimum 10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Avionics/Telecom industry.
• Experience in milled, sheet metal and plastic enclosure designs.
• Knowledge in 19-inch rack, ATR, VPX, JSS55555, DO-160, VME and ATCA standards.
• 10-years’ experience in Solid works / any design and drafting tools
• Knowledge of Structural and Thermal analysis.
• Ability to manage 2-member team
• As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and/or associated tooling related to the electronics infrastructure.
• The position requires highly motivated, extremely organized and self-driven individuals. As a Mechanical Engineer- Electronics Packaging Specialist will:
-Perform mechanical design and development associated with packaging electronic circuits including, assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects. 
-Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design.
-Communicate with a team of multi-disciplined engineers (Systems , Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval.
-Investigate and edit product structures, generate CAD models, 2D/3D drawings and be responsible for the final technical data package.
-Create, edit, review, and drive Engineering Changes to closure.
Self-Checking and Peer-Checking department designs and change notifications

Roles and Responsibility:
• Ability to take up mechanical design independently.
• Interact with customers and project team, capture input and design accordingly.
• Design the components to meet DFM and DFA and customer requirement.
• Should be a team player.
• Ability to manage 2-member team.

Mandatory Skill Set:
• Minimum10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Telecom industry.
• Proficiency in Solid works and AutoCAD.
• Good knowledge about BOM creation, material selection, Fastener selection, CNC machining and surface finish process.
• Vendor development activities.

Desired Skill Set:
• Knowledge in Structural and Thermal analysis.

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