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Staff HW Development Engr

3 months ago

Bengaluru, India Infinera Full time
  • Job description:

Thermal simulations experience:

  • Must have skills:
  • Electronics cooling background – 5+ years
  • Experience of PCBA thermal design
  • Experience in choosing heat sinks, fans, heat pipes, TIMs
  • Advanced heat sinks design (Vapor Chamber/ Heat Pipe/ Fansinks)
  • Knowledge of multiple TIMs, their uses and limitations
  • Understanding fan design parameters (size, CFM, pressure drop etc.) and modeling for thermal analysis
  • Rack/ sub--rack level thermal simulations
  • Flotherm expertise (5+ years)
  • Understanding of NEBS/ ETSI/ GR-3108 and other environmental standards from thermal perspective.
  • Takes methodical and data oriented approach to optimize number of simulations and prepares clear reports with recommendations
  • Desirable skills
  • Creo working knowledge
  • Knowledge of mechanical design of heat sinks
  • Understanding of mechanical limitations
  • Mounting mechanisms and design
  • Understanding of design limitations at heat sink/ component level
  • Knowledge of manufacturing of thermal parts and limitations in manufacturing.
  • Thermal Testing experience
  • Must have skills:
  • Independent thermal testing experience (3+ years) for line cards/ independent racks/ sub-racks/ power supplies
  • Independent airflow impedance testing (2+ years) for line cards/ independent racks/ sub-racks/ power supplies
  • Acoustics testing experience for telecom applications
  • Using thermocouples/ airflow sensors on PCBA/ rack/ sub-rack and operating thermal chambers.
  • Basic understanding of EUT/ traffic bring-up. Should have used various SW tools for test data logging from systems.
  • Understanding of thermal testing standards like NEBS/ ETSI/ GR-3108 etc.
  • Takes methodical and data oriented approach to optimize number of tests and prepares clear reports with recommendations
  • Desirable skills
  • Understanding of telecom equipment testing – router/ switch