Staff HW Development Engr
3 months ago
Thermal simulations experience:
Must have skills:Electronics cooling background – 5+ yearsExperience of PCBA thermal designExperience in choosing heat sinks, fans, heat pipes, TIMsAdvanced heat sinks design (Vapor Chamber/ Heat Pipe/ Fansinks)Knowledge of multiple TIMs, their uses and limitationsUnderstanding fan design parameters (size, CFM, pressure drop etc.) and modeling for thermal analysisRack/ sub--rack level thermal simulationsFlotherm expertise (5+ years)Understanding of NEBS/ ETSI/ GR-3108 and other environmental standards from thermal perspective.Takes methodical and data oriented approach to optimize number of simulations and prepares clear reports with recommendations Desirable skillsCreo working knowledgeKnowledge of mechanical design of heat sinksUnderstanding of mechanical limitationsMounting mechanisms and designUnderstanding of design limitations at heat sink/ component levelKnowledge of manufacturing of thermal parts and limitations in manufacturing. Thermal Testing experienceMust have skills:Independent thermal testing experience (3+ years) for line cards/ independent racks/ sub-racks/ power suppliesIndependent airflow impedance testing (2+ years) for line cards/ independent racks/ sub-racks/ power suppliesAcoustics testing experience for telecom applicationsUsing thermocouples/ airflow sensors on PCBA/ rack/ sub-rack and operating thermal chambers.Basic understanding of EUT/ traffic bring-up. Should have used various SW tools for test data logging from systems.Understanding of thermal testing standards like NEBS/ ETSI/ GR-3108 etc.Takes methodical and data oriented approach to optimize number of tests and prepares clear reports with recommendationsDesirable skillsUnderstanding of telecom equipment testing – router/ switch(Supplement No. 1 to Part 740, Title 15)
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