PDPE Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR47045 PDPE Engineer

This role is within Package and Development Engineering (PDE) group of Micron. This is a global department with teams located in USA, Singapore, Malaysia, Taiwan, and India. As a PDPE (Package Device Product Engineer) in PDE at Micron Technology, Inc., you will be responsible to prepare for new DRAM, NAND or MNAND & HBM products and coordinate resources, testing, and analysis over the lifecycle of the product. You will run data analysis and modelling, create, and maintain root cause analysis documentation, analyze parametric, probe level (FE) and electrical test (BE) data and respond to failures. In this role, you will work with various TD & NPI (new product introduction) Engineering (EFA, PFA, Assembly) and Manufacturing groups to find the root causes of the failed units.

Responsibilities and Tasks

Enable new test signals in BE which would capture assembly related failures. Ensure that Silicon & assembly process meets Product expectations by extracting and analyzing Probe and BE test data. Debug and identify root cause for failures & implement fixes for fails (Fab process or Design or Assembly Process) Work with Test Solution Engineering (TSE) & Product Engineering (PE) to ensure standardize test coverages & chars. Define Char limits, and approval of any test related changes. Participate in PG review meetings presenting the data analysis and deciding on PG exits Finding out the correlation of test failures to assembly process and updating the database with the signatures observed Development of new out-of-control-action-plan (OCAP) and its sustenance Provide Lot disposition based on parametric data observation in case of out-of-control (OOC) trigger. Support Global and Local material review board (MRB), in case of excursions and RMA, with electrical test data analysis for root cause analysis (RCA) and health of contained material.

Requirements (Must Have)

BE / MS/ MTech in Electronics, Device Physics, Applied Physics, Electrical Sound knowledge of device physics Knowledge in Engineering Statistics Experience in data (electrical) analysis and modelling (JMP, Spotfire is a plus) Experience in programming (Python or Perl) Excellent communication skills

Requirements (Good to Have)

Experience in NAND / DRAM memory or related field Knowledge in packaging assembly processes Experience in fabrication processes, electrical characterization techniques, metrology techniques

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