Wafer & Die Bonding Modeling and Simulation - Sr. Engineer
5 months ago
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR47889 Wafer & Die Bonding Modeling and Simulation - Sr. EngineerAs a wafer and die bonding modeling and simulation engineer you will be responsible for developing reliable models for wafer and die bonding processes and mechanisms using first principles physics and chemistry knowledge.You will look to extend this knowledge and propose new materials and processes via simulation to improve and or enable new materials and structures enabled by bonding of wafers or die to die or die to wafer etc.As an expert in modeling and simulating surface bonding in semiconductor processing you will be expected to work closely with engineers who will work to implement bonding based solutions in Silicon and Heterogeneous integrated circuits and semiconductor devices.
You will be a key contributor at Micron where we strive to offer greater value to our customers by designing, fabricating and enable high volume manufacturing of packaged Memory and Logic in the Advanced Packaging Technology Development team.
In this position, you will be influence Thermo-mechanical, thermal and fluid designs, finding efficient package structure and materials to mitigate any potential issues. The scope of the engineer’s work is to address all Thermo-mechanical, thermal and fluidic aspects of and 3D advanced packaging development that is associated with design, materials, and process interactions. In this role, you will collaborate with package architecture, fab/package assembly process integration and BU teams.
High powered devices like HBM, W2W, DDR RDIMM/LRDIMM modules, graphics packages and other Micron architectures require extensive engineering analysis and design to meet the mechanical requirements of the future. Finite element analysis of package designs enables innovation and the development of outstanding solutions to help further our goals. Utilization of data science techniques and the application to our industry will make Micron more impactful and relevant. Key aspects of this role will be to Innovate, Influence, Collaborate, Partner, and Implement.
Support Advance Packaging development Team - Bonding & Packaging Design
Maintain knowledge in semiconductor and general electronics packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip-On-Board (COB), Flip Chip, Through Silicon Vias (TSV), etc. Detailed understanding of wafer-to-wafer bonding process and the corresponding Multiphysics mechanisms involved to capture in the simulation. Knowledgeable with package design processes and guidelines Work with multi-functional global teams (namely Front-end design, product engineering, Technology development, Business unit, manufacturing, and external programs to fully understand and characterize manufacturing processes and packaging issues to enable simulation support with empirical validation Understanding of packaging materials and their production processes. Work with internal/external vendors and testing labs to design and implement effective testing procedures to characterize materials for simulation analysis. Maintain an understanding of measurement methodologies and coordinate measurement data collection of packages and packaging materials for correlation and development of simulation activities. Provide engineering analysis to support the development and direction of the packaging materials and technologies. Develop and apply advanced design and engineering analysis to Perform Simulations Use Engineering and Finite Element Analysis to support Assembly Packaging TD in the following areas: predictive analysis, design optimization, material/component testing design and hardware specifications, component. Use advanced analysis techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal, mechanical, and electro-mechanical simulation applications such as ANSYS, Icepak, Flotherm and others as needed. Improve material characterization and techniques. Improve simulation capabilities and techniques. Build simulation analysis reports using software such as Word, Excel, and PowerPoint to effectively communicate analysis results and conclusions. Effectively communicate simulation analysis reports to those needing the information to support efficient package build. Use standard documentation and storage tools such as SharePoint, EDC and OneDrive for the accurate and timely upkeep of Design Simulation documentation
Experience:
5-8 years working experience in Mechanical/Material Science Engineering in semiconductor industry or equivalent.
Experience with
Engineering tools : ANSYS Workbench, APDL, IcePak, Abaqus, ProE, AutoCAD, Solid Works, MATLAB Semiconductor Process Technology is a plus.
Education
/ in Mechanical Engineering, Material Science, or related Science or Engineering field.
Preferred Skills/knowledge:
Simulation, modeling, and analysis of thermo mechanical and multi-physics problems with software like Ansys, COMSOL, IcePak, Flotherm etc. Design of experiments and proven academic training and research experience in Solid and fluid mechanics Experience in performing fracture simulations for IC packages. Experience in semiconductor process simulation like wafer-to-wafer bonding process, compression bonding process, reflow process, die ejection process etc. Capability to develop new characterization methods for new design materials. Knowledge in product reliability tests like cycling, environmental and drop tests. Mechanical design capability (2D, 3D) with SolidWorks, AutoCAD, etc. Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results. Data acquisition experience and numerical analysis proficiency in MATLAB, Excel, JMP, etc. Proficient in Microsoft Office products Looking for a passionate, hardworking, and self-motivated individual with the ability to handle multiple tasks, use good time management, good communication, and while being a great teammate who is optimistic and responsible.-
Hyderabad, Telangana, India Micron Full timeJob Title: Wafer and Die Bonding Modeling and Simulation EngineerMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence.Job Summary:We are seeking a highly skilled Wafer and Die Bonding Modeling and Simulation Engineer to join our Advanced Packaging Technology...
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Hyderabad, Telangana, India Micron Full timeAt Micron, we are seeking a talented Senior Engineer to join our Advanced Packaging Technology Development team.The successful candidate will be responsible for developing reliable models for wafer and die bonding processes and mechanisms using first principles physics and chemistry knowledge.Key aspects of this role will be to innovate, influence,...
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